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LP5907UVX-1.8-NOPB Datasheet(PDF) 4 Page - Texas Instruments

Part # LP5907UVX-1.8-NOPB
Description  ULTRA LOW NOISE, 250-mA LINEAR REGULATOR FOR RF AND ANALOG CIRCUITS
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LP5907UVX-1.8-NOPB Datasheet(HTML) 4 Page - Texas Instruments

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LP5907
SNVS798D – APRIL 2012 – REVISED NOVEMBER 2012
www.ti.com
ELECTRICAL CHARACTERISTICS
(1) (2) (3)
Limits in standard typeface are for TA = 25°C. Limits in boldface type apply over the full operating junction temperature range
(–40°C
≤ TJ ≤ +125°C). Unless otherwise noted, specifications apply to LP5907 (all packages) Typical Application Circuit (pg.
1) with:
VIN = VOUT (NOM) + 1 V, VEN = 1.2 V, CIN = 1 µF, COUT = 1 µF, IOUT = 1 mA.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VIN
Input voltage
2.2
5.5
V
VIN = (VOUT(NOM) + 1 V) to 5.5 V,
–2
2
IOUT = 1 mA to 200 mA
Output voltage tolerance
%
VIN = (VOUT(NOM) + 1 V) to 5.5 V,
IOUT = 1 mA to 200 mA
-3
3
ΔVOUT
(VOUT < 1.8V, SOT23)
VIN = (VOUT(NOM) + 1 V) to 5.5 V,
Line regulation
0.02
%/V
IOUT = 1 mA
Load regulation
IOUT = 1 mA to 250 mA
0.001
%/mA
Load current
See (4)
ILOAD
mA
Maximum output current
250
VEN = 1.2 V, IOUT = 0 mA
12
25
IQ
Quiescent current(5)
VEN = 1.2 V, IOUT = 250 mA
250
425
µA
VEN = 0.3 V (Disabled)
0.2
1
IG
Ground current(6)
IOUT = 0 mA (VEN = 1.2 V)
14
µA
VOUT = 2.8 V, IOUT = 100 mA
50
VOUT = 2.8 V, IOUT = 250 mA
120
200
VDO
Dropout voltage(7)
mV
VOUT = 2.8 V, IOUT = 250 mA (SOT23
250
package)
ISC
Short circuit current limit
See (8)
250
500
mA
f = 100 Hz, IOUT = 20 mA
90
f = 1 kHz, IOUT = 20 mA
82
Power supply rejection
PSRR
dB
ratio(9)
f = 10 kHz, IOUT = 20 mA
65
f = 100 kHz, IOUT = 20 mA
60
IOUT = 1 mA
10
eN
Output noise voltage(9)
BW = 10 Hz to 100 kHz
µVRMS
IOUT = 250 mA
6.5
Temperature
160
TSHUTDOWN
Thermal shutdown
°C
Hysteresis
15
LOGIN INPUT THRESHOLDS
VIL
Low input threshold (VEN)
VIN = 2.2 V to 5.5 V
0.4
V
VIH
High input threshold (VEN)
VIN = 2.2 V to 5.5 V
1.2
V
VEN = 5.5 V and VIN = 5.5 V
5.5
IEN
Input current at VEN Pin
(10)
µA
VEN = 0 V and VIN = 5.5 V
0.001
(1)
All voltages are with respect to the potential at the GND pin.
(2)
Min and Max limits are ensured by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most
likely norm.
(3)
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the
part/package in the application
θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). See applications section.
(4)
The device maintains a stable, regulated output voltage without a load current.
(5)
Quiescent current is defined here as the difference in current between the input voltage source and the load at VOUT.
(6)
Ground current is defined here as the total current flowing to ground as a result of all input voltages applied to the device.
(7)
Dropout voltage is the voltage difference between the input and the output at which the output voltage drops to 100 mV below its
nominal value.
(8)
Short Circuit Current is measured with VOUT pulled to 0 V and VIN worst case = 6 V.
(9)
This specification is ensured by design.
(10) There is a 1-M
Ω resistor between VEN and ground on the device.
4
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Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: LP5907


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