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A3944 Datasheet(PDF) 10 Page - Allegro MicroSystems

Part # A3944
Description  Automotive, Low-Side FET Pre-Driver
Download  31 Pages
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Manufacturer  ALLEGRO [Allegro MicroSystems]
Direct Link  http://www.allegromicro.com
Logo ALLEGRO - Allegro MicroSystems

A3944 Datasheet(HTML) 10 Page - Allegro MicroSystems

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Automotive, Low Side FET Pre-Driver
A3944
10
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
high, in other words the logical OR of the INx input and the Gx
bit for each channel x. If the GATx output is to be controlled by
the serial interface, then the corresponding INx logic input should
be held low. Internal pull-down resistors from each INx terminal
to GND ensure that any unconnected input will be pulled low.
Conversely, if the GATx output is to be controlled by the INx
logic input, then the corresponding Gx bit in the control register
should be set to 0, which is its default power-on and reset state.
Gate Drive Output
Each gate drive output is designed to provide symmetrical charge
current from the VDR supply terminal and discharge current to
the GND return terminal. The maximum source and sink imped-
ance provides peak charge and discharge currents of at least
50 mA when connected directly to the gate of the external FET.
This current can be limited, in order to limit the FET turn-on
switching speed, by using a resistor between the GATx output
and the gate of the FET. Although the GATx drive is designed to
be symmetrical, the actual drive performance will be affected by
the FET parameters and the resistance between the GATx output
and the gate of the FET.
The VDR supply is used only to supply the GATx output. The
voltage at VDR can therefore be varied to provide voltage limited
drive to the FET gate. Undervoltage detection is not provided for
this supply.
Reset Function
If RESETN is held low for more than the minimum reset pulse
width, then all registers are reset to their power-on state, and all
GATx outputs are held low. Any latched channel faults and cor-
responding bits in the fault register are reset, the logic reset (LR)
bit is set, and the UV and OT bits reflect the status of the under-
voltage and overtemperature detectors.
The RESETN input uses a glitch filter to reduce the susceptibility
to transients and noise on the RESETN input. This glitch filter
is guaranteed to ignore any pulses shorter than the minimum
RESETN glitch filter time, tRGF.
Channel Fault Diagnostics
All channel faults are determined by monitoring the voltage at the
drain of the external FET through the DRNx terminal. Each chan-
nel has independent bias current generators, programmable fault
comparators, fault decode logic, and programmable fault timers.
The serial interface provides a dedicated fault configuration reg-
ister for each channel to select these features and thresholds per
channel. A single fault mask register provides a fault mask bit for
each channel. Fault detection is disabled when RESETN is low or
when the fault mask bit is set. Fault reporting through the serial
interface is fully described in the Serial Interface section below.
A short to battery (short across the load to the load supply) can be
detected when the channel is active, GATx is high, and the FET
is on (on-state). A short to battery fault always attempts to protect
the FET by pulling GATx low.
A short to ground or open load can be detected when GATx is
low and the FET is off (off-state). A short to ground fault or
open load fault does not interfere with the operation of the GATx
output.
Each channel fault detected is latched as a fault state, and remains
latched until the diagnostic circuits can determine that the fault
has been removed for that channel. This determination can only
occur at the end of a fault blank time. For short to battery this is
at the end of the on-state fault blank time following a transition
from off to on. For a short to ground or open load this is at the
end of the off-state fault blank time following a transition from
on to off.
When a fault is detected, a dedicated bit in one of the two fault
registers is set for each fault on each channel. This requires 3 bits
per channel over 6 channels or 18 fault bits in total. The fault bits
in the fault registers remain latched until the first serial transfer
after the associated fault state has been reset. All latched fault
states and all latched channel fault bits can also be cleared either
by a power-on reset or by taking the RESETN terminal low.
Practical limits for load resistance, and voltage conditions to
provide effective determination of the load status, are discussed
in the Applications Information section below.
Note that each DRNx terminal has an internal Zener clamp which
limits the voltage at the terminal to VDCL. If the voltage at the
drain of the FET is likely to be higher than VDCL, even dur-
ing a transient, then a current limit resistor, RDx, must be added


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