CM450DY-24S

Dual IGBTMOD™ S-Series Module

450 Amperes/1200 Voltstt

Powerex, Inc., 173 Pavilion Lane,Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com

4

09/11 Rev. 1

Thermal Resistance Characteristics,

Per Inverter IGBT

—

—

0.045

K/W

Per Inverter FWDi

—

—

0.068

K/W

Contact Thermal Resistance,

Thermal Grease Applied

—

0.018

—

K/W

Mechanical Characteristics

Mounting Torque

Main Terminals, M6 Screw

31

35

40

in-lb

Mounting to Heatsink, M6 Screw

31

35

40

in-lb

Creepage Distance

Terminal to Terminal

—

—

—

mm

Terminal to Baseplate

—

—

—

mm

Clearance

Terminal to Terminal

—

—

—

mm

Terminal to Baseplate

—

—

—

mm

Weight

m

—

580

—

Grams

Flatness of Baseplate

-100

—

±100

µm

Recommended Operating Conditons,

(DC) Supply Voltage

Applied Across C1-E2

—

600

850

Volts

Gate (-Emitter Drive) Voltage

Applied Across G1-Es1 / G2-Es2

13.5

15.0

16.5

Volts

External Gate Resistance

Per Switch

0

—

8

Ω

(mounting side) of the baseplate and the heatsink side just under the chips.

Refer to the figure to the right for chip location.

The heatsink thermal resistance should be measured just under the chips.

*6 Typical value is measured by using thermally conductive grease of λ = 0.9 [W/(m • K)].

*7 Baseplate (mounting side) flatness measurement points (X, Y) are shown in the figure below.

X

BOTTOM

– CONCAVE

3 mm

+ CONVEX

BOTTOM

BOTTOM

LABEL SIDE

Y

0

0

Di1

Di1

Di1

Tr2 Tr2 Tr2

Tr1

Tr1

Tr1

Di2 Di2 Di2

21.5

21.6

35.0

48.2

48.4

45.6

33.3

LABEL SIDE

Tr1 / Tr2: IGBT, Di1 / Di2: FWDi

Each mark points to the center position of each chip.