HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : IC200803

Issued Date : 2008.09.10

Revised Date :

Page No. : 6/6

H6842P, H6842S

HSMC Product Specification

DIP-8 Dimension

A

B

87

65

4

3

2

1

H

I

F

G

J

K

M

L

E

D

C

8-Lead DIP-8

Plastic Package

HSMC Package Code: P

Marking:

Date Code

Control Code

HP

6842

Pb Free Mark

Pb-Free: "

Normal: None

Note: Green label is used for pb-free packing

Pin Style: 1.GND 2.FB 3.VIN 4.RI

Material:

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

DIM

Min.

Max.

A

6.29

6.40

B

9.22

9.32

C

-

*1.52

D

-

*1.27

E

-

*0.99

F

3.25

3.35

G

3.17

3.55

H

0.38

0.53

I

2.28

2.79

J

7.49

7.74

K

-

*3.00

L

8.56

8.81

M

0.229

0.381

94

o

97

o

α1

*: Typical, Unit: mm

SO-8 Dimension

A

B

F

C

D

E

G

Part A

I

H

J

K

O

M

L

N

Part A

23

4

5

6

7

8

Pin1 Index

DIM

Min.

Max.

A

4.85

5.10

B

Marking:

Note: Green label is used for pb-free packing

3.85

3.95

C

5.80

6.20

D

1.22

1.32

E

0.37

0.47

F

3.74

3.88

G

1.45

1.65

H

4.80

5.10

I

0.05

0.20

J

0.30

0.70

Pin Style: 1.GND 2.FB 3.VIN 4.RI

K

0.19

0.25

L

0.37

0.52

Material:

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V 0

M

0.23

0.28

N

0.08

0.13

O

0.00

0.15

*: Typical, Unit: mm

8-Lead SO-8 Plastic

Surface Mounted Package

HSMC Package Code: S

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its products without notice.

• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office And Factory:

• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.

Tel: 886-2-25212056

Fax: 886-2-25632712, 25368454