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HLM358 Datasheet(PDF) 6 Page - Hi-Sincerity Mocroelectronics |
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HLM358 Datasheet(HTML) 6 Page - Hi-Sincerity Mocroelectronics |
6 / 6 page HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : IC200409 Issued Date : 2004.05.01 Revised Date : 2004.05.14 Page No. : 6/7 HLM358P, HLM358S HSMC Product Specification DIP-8 Dimension SO-8 Dimension Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 A B 87 65 4 3 2 1 H I F G J K M L α1 E D C 8-Lead DIP-8 Plastic Package HSMC Package Code: P Marking: Date Code Control Code HP L M 358 Pb Free Mark Pb-Free: " . " (Note) Normal: None Note: Green label is used for pb-free packing Pin Style: 1.Output 1 2.Inverting input 1 3.Non inverting input 1 4.V EE 5.Non inverting input 2 6.Inverting input 2 7. Output 2 8.V CC Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 DIM Min. Max. A 6.29 6.40 B 9.22 9.32 C- *1.52 D- *1.27 E- *0.99 F 3.25 3.35 G 3.17 3.55 H 0.38 0.53 I 2.28 2.79 J 7.49 7.74 K- *3.00 L 8.56 8.81 M 0.229 0.381 α1 94o 97o *: Typical, Unit: mm A B F C D E G Part A I H J K O M L N Part A 23 4 5 6 7 8 Pin1 Index DIM Min. Max. A 4.85 5.10 B 3.85 3.95 C 5.80 6.20 D 1.22 1.32 E 0.37 0.47 F 3.74 3.88 G 1.45 1.65 H 4.80 5.10 I 0.05 0.20 J 0.30 0.70 K 0.19 0.25 L 0.37 0.52 M 0.23 0.28 N 0.08 0.13 O 0.00 0.15 *: Typical, Unit: mm Marking: Date Code Control Code Pin 1 Index HS LM 3 Pb Free Mark Pb-Free: " . " (Note) Normal: None 58 Note: Green label is used for pb-free packing Pin Style: 1.Output 1 2.Inverting input 1 3.Non inverting input 1 4.V EE 5.Non inverting input 2 6.Inverting input 2 7. Output 2 8.V CC Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 8-Lead SO-8 Plastic Surface Mounted Package HSMC Package Code: S |
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