Manufacturer | Part # | Datasheet | Description |
Maxim Integrated Produc... |
21-0141
|
104Kb / 2P |
PACKAGE OUTLINE, 36,40,48L THIN QFN, 6*6*0.75MM
Rev N |
21-0144
|
128Kb / 2P |
PACKAGE OUTLINE 32,44,48,56L THIN QFN, 7*7*0.75MM
REV .K |
21-0136F
|
55Kb / 2P |
PACKAGE OUTLINE 12,16L THIN QFN, 3x3x0.8mm
Rev F |
21-0181
|
66Kb / 2P |
PACKAGE OUTLINE, 43L THIN QFN, 3.5*9*0.8MM
REV .C |
21-0664
|
46Kb / 2P |
PACKAGE OUTLINE 12L TDFN, 3*3*0.75MM
REV .B |
Zetex Semiconductors |
SC70-5
|
195Kb / 3P |
Surface mounted, 5 pin package Package outline
|
Maxim Integrated Produc... |
21-0139
|
74Kb / 2P |
PACKAGE OUTLINE, 12,16,20,24,28L TQFN, 4*4*0.75MM
REV .L |
21-0429
|
71Kb / 2P |
PACKAGE OUTLINE, 10L TDFN, 3*2*0.75MM
REV .C |
Dallas Semiconductor |
21-0102
|
109Kb / 2P |
PACKAGE OUTLINE, 12,16L QFN, 3x3x0.90 MM
|
Fujitsu Component Limit... |
FPT-20P-M04
|
37Kb / 1P |
THIN SHRINK SMALL OUTLINE PACKAGE
|