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MAX19757ETX+T Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX19757ETX+T Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 34 page MAX19757 Dual, SiGe, High-Linearity, 1700MHz to 2700MHz Downconversion Mixer with Advanced Shutdown Features www.maximintegrated.com Maxim Integrated │ 2 5V DC Electrical Characteristics (Typical Application Circuit, VCC=4.75Vto5.25V,R1=4.87kΩ,R3=154kΩtoVCC,RFandIFsingleendedports=50ΩtoGND, LO1portdrivenfrom50Ωsource,PLO = 0dBm, fLO = 2350MHz, LOSEL = 5V, LO_TUNE1 = LO_TUNE2 = 1, PD1 = PD2 = STBY = 0, TC = -40°C to +105°C. Typical values are at VCC = 5.0V, PLO = 0dBm, fLO = 2350MHz, LO_TUNE1 = LO_TUNE2 = 1, TC = +25°C, unless otherwise noted.) (Notes 5, 6) Note 3: Junction temperature TJ = TA+(θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is known. The junction temperature must not exceed +150°C. Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. VCC.......................................................................-0.3V to +5.5V RFMAIN, RFDIV, LO1, LO2, IFM+, IFM-, IFD+, IFD-......................... -0.3V to (VCC + 0.3V) IF_RADJ, LO_VADJ, LOSEL, LO_TUNE1, LO_TUNE2 ...................... -0.3V to (VCC + 0.3V) RFMAIN to RFM_RTN, RFDIV to RFD_RTN.....................20mA PD1, PD2, STBY, IF_DET_OUT, IF_DET_CEXT...................................... -0.3V to (VCC + 0.3V) RFMAIN, RFDIV, LO1, LO2 Input Power.......................+20dBm Continuous Power Dissipation (Note 1) ..............................8.7W Operating Case Temperature Range (Note 2)... -40°C to +105°C Maximum Junction Temperature .....................................+150°C Storage Temperature Range............................ -65°C to +150°C Lead Temperature (soldering 10s) ..................................+300°C Soldering Temperature (reflow).......................................+260°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics TQFN Junction-to-AmbientThermalResistanceθJA (Notes 3, 4)................................................................+36°C/W Junction-to-CaseThermalResistanceθJC (Notes 1, 4)...............................................................+7.4°C/W Absolute Maximum Ratings Note 1: Based on junction temperature TJ = TC+(θJC x VCC x ICC). This formula can be used when the temperature of the exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction temperature must not exceed +150°C. Note 2: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB. PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage Vcc 4.75 5.00 5.25 V Dual-Channel Operation Supply Current IDUALCH fLO = 1800MHz, LO_TUNE1 = 0, LO_TUNE2 = 1 350 420 mA fLO = 1900MHz, LO_TUNE1 = 0, LO_TUNE2 = 1 324 395 fLO = 2100MHz, LO_TUNE1 = 0, LO_TUNE2 = 0 305 365 fLO = 2300MHz, LO_TUNE1 = 1, LO_TUNE2 = 1 293 350 fLO = 2350MHz, LO_TUNE1 = 1, LO_TUNE2 = 1 290 350 fLO = 2500MHz, LO_TUNE1 = 1, LO_TUNE2 = 0 285 345 |
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