MAX19757ETX+T datasheet(2/34 Pages) MAXIM

Part #	MAX19757ETX+T

Description	Dual, SiGe, High-Linearity, 1700MHz to 2700MHz Downconversion Mixer

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Manufacturer	MAXIM [Maxim Integrated Products]

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MAX19757

Dual, SiGe, High-Linearity,

1700MHz to 2700MHz Downconversion Mixer with

Advanced Shutdown Features

www.maximintegrated.com

Maxim Integrated │ 2

5V DC Electrical Characteristics

(Typical Application Circuit, VCC=4.75Vto5.25V,R1=4.87kΩ,R3=154kΩtoVCC,RFandIFsingleendedports=50ΩtoGND,

LO1portdrivenfrom50Ωsource,PLO = 0dBm, fLO = 2350MHz, LOSEL = 5V, LO_TUNE1 = LO_TUNE2 = 1, PD1 = PD2 = STBY = 0,

TC = -40°C to +105°C. Typical values are at VCC = 5.0V, PLO = 0dBm, fLO = 2350MHz, LO_TUNE1 = LO_TUNE2 = 1, TC = +25°C,

unless otherwise noted.) (Notes 5, 6)

Note 3: Junction temperature TJ = TA+(θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is

known. The junction temperature must not exceed +150°C.

Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

VCC.......................................................................-0.3V to +5.5V

RFMAIN, RFDIV, LO1, LO2,

IFM+, IFM-, IFD+, IFD-......................... -0.3V to (VCC + 0.3V)

IF_RADJ, LO_VADJ, LOSEL,

LO_TUNE1, LO_TUNE2 ...................... -0.3V to (VCC + 0.3V)

RFMAIN to RFM_RTN, RFDIV to RFD_RTN.....................20mA

PD1, PD2, STBY, IF_DET_OUT,

IF_DET_CEXT...................................... -0.3V to (VCC + 0.3V)

RFMAIN, RFDIV, LO1, LO2 Input Power.......................+20dBm

Continuous Power Dissipation (Note 1) ..............................8.7W

Operating Case Temperature Range (Note 2)... -40°C to +105°C

Maximum Junction Temperature .....................................+150°C

Storage Temperature Range............................ -65°C to +150°C

Lead Temperature (soldering 10s) ..................................+300°C

Soldering Temperature (reflow).......................................+260°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics

TQFN

Junction-to-AmbientThermalResistanceθJA

(Notes 3, 4)................................................................+36°C/W

Junction-to-CaseThermalResistanceθJC

(Notes 1, 4)...............................................................+7.4°C/W

Absolute Maximum Ratings

Note 1: Based on junction temperature TJ = TC+(θJC x VCC x ICC). This formula can be used when the temperature of the

exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The

junction temperature must not exceed +150°C.

Note 2: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage

Vcc

4.75

5.00

5.25

V

Dual-Channel Operation

Supply Current

IDUALCH

fLO = 1800MHz,

LO_TUNE1 = 0, LO_TUNE2 = 1

350

420

mA

fLO = 1900MHz,

LO_TUNE1 = 0, LO_TUNE2 = 1

324

395

fLO = 2100MHz,

LO_TUNE1 = 0, LO_TUNE2 = 0

305

365

fLO = 2300MHz,

LO_TUNE1 = 1, LO_TUNE2 = 1

293

350

fLO = 2350MHz,

LO_TUNE1 = 1, LO_TUNE2 = 1

290

350

fLO = 2500MHz,

LO_TUNE1 = 1, LO_TUNE2 = 0

285

345

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