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AD73322LAST Datasheet(PDF) 7 Page - Analog Devices |
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AD73322LAST Datasheet(HTML) 7 Page - Analog Devices |
7 / 40 page REV. 0 AD73322L –7– CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD73322L features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE ABSOLUTE MAXIMUM RATINGS * (TA = 25 °C unless otherwise noted) AVDD, DVDD to GND . . . . . . . . . . . . . . . –0.3 V to +4.6 V AGND to DGND . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V Digital I/O Voltage to DGND . . . –0.3 V to (DVDD + 0.3 V) Analog I/O Voltage to AGND . . . –0.3 V to (AVDD + 0.3 V) Operating Temperature Range Industrial (A Version) . . . . . . . . . . . . . . . –40 °C to +85°C Extended (Y Version) . . . . . . . . . . . . . . . . –40 °C to +105°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Maximum Junction Temperature . . . . . . . . . . . . . . . . 150 °C SOIC, θJA Thermal Impedance . . . . . . . . . . . . . . . 71.4°C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220 °C LQFP, θ JA Thermal Impedance . . . . . . . . . . . . . . . 53.2 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220 °C ORDERING GUIDE Temperature Package Package Model Range Descriptions Option AD73322LAR –40 °C to +85°C Wide Body SOIC R-28 AD73322LARU –40 °C to +85°C Thin Shrink TSSOP RU-28 AD73322LAST –40 °C to +85°C Plastic Thin Quad ST-44A Flatpack (LQFP) AD73322LYR –40 °C to +105°C Wide Body SOIC R-28 AD73322LYRU –40 °C to +105°C Thin Shrink TSSOP RU-28 AD73322LYST –40 °C to +105°C Plastic Thin Quad ST-44A Flatpack (LQFP) EVAL-AD73322LEB Evaluation Board PIN CONFIGURATIONS 28-Lead Wide Body SOIC (R-28) TOP VIEW (Not to Scale) 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 2 3 4 5 6 7 8 9 10 11 12 13 14 AD73322L SDO MCLK SCLK RESET DVDD DGND AGND2 VINP1 VFBP1 VINN1 VFBN1 AVDD2 REFCAP REFOUT SDOFS SDIFS SDI SE AGND1 AVDD1 VOUTP2 VFBN2 VINN2 VFBP2 VINP2 VOUTN2 VOUTP1 VOUTN1 44-Lead Plastic Thin Quad Flatpack (LQFP) (ST-44A) 3 4 5 6 7 1 2 10 11 8 9 40 39 38 41 42 43 44 36 35 34 37 29 30 31 32 33 27 28 25 26 23 24 PIN 1 IDENTIFIER TOP VIEW (Not to Scale) AD73322L 12 13 14 15 16 17 18 19 20 21 22 NC VOUTN1 VOUTP1 NC VOUTN2 VOUTP2 NC REFOUT REFCAP AVDD2 AVDD2 AGND2 AGND2 AGND2 NC = NO CONNECT AGND2 DGND DGND DVDD AVDD1 AVDD1 AGND1 AGND1 28-Lead Thin Shrink TSSOP (RU-28) TOP VIEW (Not to Scale) 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 2 3 4 5 6 7 8 9 10 11 12 13 14 AD73322L SDO MCLK SCLK RESET DVDD DGND AGND2 VINP1 VFBP1 VINN1 VFBN1 AVDD2 REFCAP REFOUT SDOFS SDIFS SDI SE AGND1 AVDD1 VOUTP2 VFBN2 VINN2 VFBP2 VINP2 VOUTN2 VOUTP1 VOUTN1 TSSOP, θ JA Thermal Impedance . . . . . . . . . . . . . . 97.9 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220 °C *Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. |
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