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AD7740YRM Datasheet(PDF) 3 Page - Analog Devices

Part # AD7740YRM
Description  3 V/5 V Low Power, Synchronous Voltage-to-Frequency Converter
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

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AD7740
REV. 0
–3–
(VDD = 3.0 V to 3.6 V, 4.75 V to 5.25 V, GND = O V, REFIN = 2.5 V)
Limit at TMIN, TMAX
Limit at TMIN, TMAX
Parameter
VDD = 3.0 V to 3.6 V
VDD = 4.75 V to 5.25 V
Unit
Conditions/Comments
fCLKIN
32
32
kHz min
Clock Frequency
1
1
MHz max
tHIGH:tLOW
40:60
40:60
min
Clock Mark/Space Ratio
60:40
60:40
max
t1
50
35
ns typ
CLKIN Edge to FOUT Edge Delay
t2
2.3
1.8
ns typ
FOUT Rise Time
t3
1.6
1.4
ns typ
FOUT Fall Time
t4
tHIGH
±20
tHIGH
±8
ns typ
FOUT Pulsewidth
NOTES
1Guaranteed by design and characterization, not production tested.
2All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of (V
IL + VIH)/2.
3See Figure 1.
Specifications subject to change without notice
t3
t2
t1
t4
tHIGH
tLOW
CLKIN
FOUT
Figure 1. Timing Diagram
TIMING CHARACTERISTICS1, 2, 3
ABSOLUTE MAXIMUM RATINGS
*
(TA = 25
°C unless otherwise noted)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Analog Input Voltage to GND . . . . . . . . –0.3 V to VDD + 0.3 V
Reference Input Voltage to GND . . . . . –0.3 V to VDD + 0.3 V
Logic Input Voltage to GND . . . . . . . . –0.3 V to VDD + 0.3 V
FOUT Voltage to GND . . . . . . . . . . . –0.3 V to VDD + 0.3 V
Operating Temperature Range
Commercial (K Version) . . . . . . . . . . . . . . . . 0
°C to +85°C
Automotive (Y Version) . . . . . . . . . . . . . . –40
°C to +105°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature (TJ Max) . . . . . . . . . . . . . . . . . . 150
°C
SOT-23 Package
Power Dissipation . . . . . . . . . . . . . . . . . . (TJ Max – TA)/
θ
JA
θ
JA Thermal Impedance
. . . . . . . . . . . . . . . . . . . . . 240
°C/W
Lead Temperature (10 secs) . . . . . . . . . . . . . . . . . . 300
°C
Reflow Soldering
Peak Temperature . . . . . . . . . . . . . . . . . . . . 220 + 5/0
°C
Time at Peak Temperature . . . . . . . . . . . . 10 sec to 40 sec
microSOIC Package
Power Dissipation . . . . . . . . . . . . . . . . . (TJ Max – TA)/
θ
JA
θ
JA Thermal Impedance
. . . . . . . . . . . . . . . . . . . . . 206
°C/W
θ
JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 44
°C/W
Lead Temperature (10 secs) . . . . . . . . . . . . . . . . . . . 300
°C
Reflow Soldering
Peak Temperature . . . . . . . . . . . . . . . . . . . . . . 220 +5/0
°C
Time at Peak Temperature . . . . . . . . . . . . . 10 sec to 40 sec
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD7740 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE


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