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AD7827 Datasheet(PDF) 4 Page - Analog Devices |
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AD7827 Datasheet(HTML) 4 Page - Analog Devices |
4 / 12 page AD7827 –4– REV. 0 WARNING! ESD SENSITIVE DEVICE CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD7827 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. PIN FUNCTION DESCRIPTIONS Pin No. Mnemonic Description 1 CONVST Convert Start. Puts the track-and- hold into hold mode and initiates a conversion. The state of this pin at the end of conversion also determines whether or not the part is powered down. 2V IN Analog Input is applied here. 3 RFS Receive Frame Sync. This is an output. When this signal goes logic high at the end of a conversion, the DSP starts latching in data on the next cycle of SCLK. 4 GND Ground reference for analog and digital circuitry. 5V REF Reference Input. 6D OUT Serial Data is shifted out on this pin. Data is clocked out by the rising edges of SCLK. 7 SCLK Serial Clock. An external serial clock is applied here. The clock must be continuous so the RFS (frame SYNC) can be synchronized to the clock for high speed data transfers. (See Microprocessor Interfacing section.) 8V DD Positive Supply Voltage 3 V/5 V ± 10%. PIN CONFIGURATION TOP VIEW (Not to Scale) 8 7 6 5 1 2 3 4 CONVST VIN RFS VDD SCLK DOUT VREF GND AD7827 ABSOLUTE MAXIMUM RATINGS* VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V Digital Input Voltage to GND ( CONVST, SCLK) . . . . . . . . . . . . . . –0.3 V, V DD + 0.3 V Digital Output Voltage to GND (DOUT, RFS) . . . . . . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V VREF to GND . . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V Analog Input Voltage to AGND . . . . . . –0.3 V, VDD + 0.3 V Operating Temperature Range Industrial (B Version) . . . . . . . . . . . . . . . –40 °C to +105°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . +300 °C Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . +105°C/W Lead Temperature, (Soldering 10 sec) . . . . . . . . . . +260 °C SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . +75°C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.0 kV *Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ORDERING GUIDE Linearity Error Package Package Model (LSB) Description Option AD7827BN ±0.5 LSB Plastic DIP N-8 AD7827BR ±0.5 LSB Small Outline IC SO-8 |
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