REV. A

–4–

AD7834/AD7835

ABSOLUTE MAXIMUM RATINGS

1

(Whichever Is Lower)

AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +0.3 V

Operating Temperature Range

Industrial (A Version) . . . . . . . . . . . . . . . . . –40

°C to +85°C

Extended (S Version). . . . . . . . . . . . . . . . . –55

°C to +125°C

Storage Temperature Range . . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150

°C

Plastic Package

θ

. . . . . . . . . . . . . . . . . . . . . +75

°C/W

Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260

°C

Cerdip Package

θ

. . . . . . . . . . . . . . . . . . . . . +52

°C/W

Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +300

°C

WARNING!

ESD SENSITIVE DEVICE

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the AD7834/AD7835 feature proprietary ESD protection circuitry, permanent damage

may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

ORDERING GUIDE

Linearity

Temperature

Error

DNL

Package

Model

Range

(LSBs)

(LSBs)

Option

1

AD7834AR

–40

°C to +85°C

±2

±0.9

R-28

AD7834BR

–40

°C to +85°C

±1

±0.9

R-28

AD7834AN

–40

°C to +85°C

±2

±0.9

N-28

AD7834BN

–40

°C to +85°C

±1

±0.9

N-28

AD7834SQ

–55

°C to +125°C

±2

±0.9

Q-28

AD7835AS

2

–40

°C to +85°C

±2

±0.9

S-44

AD7835BS

2

–40

°C to +85°C

±1

±0.9

S-44

–40

°C to +85°C

±2

±0.9

P-44A

NOTES

P = Plastic Leaded Chip Carrier (PLCC).

SOIC Package

θ

. . . . . . . . . . . . . . . . . . . . . +75

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

PQFP Package

θ

. . . . . . . . . . . . . . . . . . . . . . 95

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

PLCC Package

θ

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

Power Dissipation (Any Package) . . . . . . . . . . . . . . . . 480 mW

NOTES

permanent damage to the device. This is a stress rating only and functional

operation of the device at these or any other conditions above those indicated in the

operational section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.