REV. B

AD8004

–4–

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the AD8004 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

ABSOLUTE MAXIMUM RATINGS

1

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.6 V

Internal Power Dissipation

2

Plastic DIP Package (N) . . . . . . . . . Observe Derating Curves

Small Outline Package (R) . . . . . . . . Observe Derating Curves

Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . .

±V

S

Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . .

±2.5 V

Output Short Circuit Duration

. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves

Storage Temperature Range (N, R) . . . . . . . –65

°C to +125°C

Operating Temperature Range (A Grade) . . . – 40

°C to +85°C

Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300

°C

NOTES

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

14-Lead Plastic DIP Package:

θ

14-Lead SOIC Package:

θ

ORDERING GUIDE

Temperature

Package

Package

Model

Range

Description

Option

AD8004AN

– 40

°C to +85°C 14-Lead Plastic DIP N-14

AD8004AR-14

– 40

°C to +85°C 14-Lead SOIC

R-14

AD8004AR-14-REEL

– 40

°C to +85°C 13" Tape and Reel

R-14

AD8004AR-14-REEL7 – 40

°C to +85°C 7" Tape and Reel

R-14

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the

AD8004 is limited by the associated rise in junction tempera-

ture. The maximum safe junction temperature for plastic

encapsulated devices is determined by the glass transition tem-

perature of the plastic, approximately +150

°C. Exceeding this

limit temporarily may cause a shift in parametric performance

due to a change in the stresses exerted on the die by the package.

Exceeding a junction temperature of +175

°C for an extended

period can result in device failure.

While the AD8004 is internally short circuit protected, this may

not be sufficient to guarantee that the maximum junction tem-

perature is not exceeded under all conditions. To ensure proper

operation, it is necessary to observe the maximum power derat-

ing curves (shown below in Figure 3).

2.0

1.5

0.5

–50 –40 –30 –20 –10

0

10

20 30

40

50

60 70

80 90

AMBIENT TEMPERATURE – C

1.0

0

14-LEAD SOIC

PACKAGE

14-LEAD PLASTIC DIP

PACKAGE

Figure 3. Maximum Power Dissipation vs. Temperature