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VTM48EF012T130A01 Datasheet(PDF) 1 Page - Vicor Corporation |
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VTM48EF012T130A01 Datasheet(HTML) 1 Page - Vicor Corporation |
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1 / 17 page  Rev. 1.2 7/2012 Page 1 of 17 VI CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 vicorpower.com VTM48EF012T130A01 VTM™ Current Multiplier VIN = 26 to 55 V VOUT = 0.7 to 1.4 V(NO LOAD) IOUT = 130 A(NOM) K = 1/40 PART NUMBER DESCRIPTION VTM48EF012T130A01 -40°C to 125°C TJ PRMTM Regulator PR PC TM +IN -IN IF RE SG VC -OUT +OUT Load 38 to 55 Vdc Input Current Sense Enable/ Disable Feedback Voltage Reference Voltage Control PC +IN -IN VC +OUT1 +OUT2 -OUT1 -OUT2 PC +IN -IN VC +OUT1 +OUT2 -OUT1 -OUT2 Constant Vc C US ® S NRTL C US FEATURES • Optimized for VR12.0 • 40 Vdc to 1 Vdc 130 A current multiplier - Operating from standard 48 V or 24 V PRM™ regulators • High efficiency (>94%) reduces system power consumption • High density (443 A/in3) • “Full Chip” VI Chip® package enables surface mount, low impedance interconnect to system board • Contains built-in protection features against: - Overvoltage - Overtemperature • Provides enable / disable control, internal temperature monitoring • ZVS / ZCS resonant Sine Amplitude Converter topology • Less than 50ºC temperature rise at full load in typical applications TYPICAL APPLICATIONS • High End Computing Systems • Automated Test Equipment • High Density Power Supplies • Communications Systems DESCRIPTION The VI Chip® current multiplier is a high efficiency (>94%) Sine Amplitude Converter™ (SAC™) operating from a 26 to 55 Vdc primary bus to deliver an isolated output. The Sine Amplitude Converter offers a low AC impedance beyond the bandwidth of most downstream regulators; therefore capacitance normally at the load can be located at the input to the Sine Amplitude Converter. Since the K factor of the VTM48EF012T130A01 is 1/40, the capacitance value can be reduced by a factor of 1600, resulting in savings of board area, materials and total system cost. The VTM48EF012T130A01 is provided in a VI Chip® package compatible with standard pick-and-place and surface mount assembly processes. The co-molded VI Chip® package provides enhanced thermal management due to a large thermal interface area and superior thermal conductivity. The high conversion efficiency of the VTM48EF012T130A01 increases overall system efficiency and lowers operating costs compared to conventional approaches. The VTM48EF012T130A01 enables the utilization of Factorized Power Architecture™ which provides efficiency and size benefits by lowering conversion and distribution losses and promoting high density point of load conversion. TYPICAL APPLICATION VTM48EF012T130A01 VTM48EF012T130A01 |
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