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EM47CM1688SBB Datasheet(PDF) 2 Page - Eorex Corporation |
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EM47CM1688SBB Datasheet(HTML) 2 Page - Eorex Corporation |
2 / 38 page EM47CM1688SBB Jun. 2012 2/38 www.eorex.com 1Gb (8M ×8Bank×16) Double DATA RATE 3 SDRAM Features • JEDEC Standard VDD/VDDQ = 1.5V±0.075V. • All inputs and outputs are compatible with SSTL_15 interface. • Fully differential clock inputs (CK, /CK) operation. • Eight Banks • Posted CAS by programmable additive latency: 0, CL-1 & CL-2 • Bust length: 4 with Burst Chop (BC) and 8. • CAS Write Latency (CWL): 5,6,7,8 • Programmable CAS Latency (CL): 6, 7, 8, 9, 10, 11 • Write Latency (WL) =Read Latency (RL) -1. • Bi-directional Differential Data Strobe (DQS). • Data inputs on DQS centers when write. • Data outputs on DQS, /DQS edges when read. • On chip DLL align DQ, DQS and /DQS transition with CK transition. • DM mask write data-in at the both rising and falling edges of the data strobe. • Sequential & Interleaved Burst type available both for 8 & 4 with BC. • Multi Purpose Register (MPR) for pre-defined pattern read out • On Die Termination (ODT) options: Synchronous ODT, Dynamic ODT, and Asynchronous ODT • Auto Refresh and Self Refresh • 8,192 Refresh Cycles / 64ms • Refresh Interval: 7.8us Tcase between 0°C ~ 85°C • Refresh Interval: 3.9us Tcase between 85°C ~ 95°C • RoHS Compliance • Driver Strength:RZQ/7, RZQ/6 (RZQ=240Ω) • High Temperature Self-Refresh rate enable • ZQ calibration for DQ drive and ODT • RESET pin for initialization and reset function Description The EM47CM1688SBB is a high speed Double Date Rate 3 (DDR3) Synchronous DRAM fabricated with ultra high performance CMOS process containing 1G bits which organized as 8Mbits x 8 banks by 16 bits. This synchronous device achieves high speed double-data-rate transfer rates of up to 1600 Mb/sec/pin (DDR3-1600) for general applications. The chip is designed to comply with the following key DDR3 SDRAM features: (1) posted CAS with additive latency, (2) write latency = read latency -1, (3) On Die Termination (4) programmable driver strength data,(5) seamless BL4 access. All of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and /CK falling). All I/Os are synchronized with a pair of bidirectional differential data strobes (DQS and /DQS) in a source synchronous fashion. The address bus is used to convey row, column and bank address information in a /RAS and /CAS multiplexing style. The 1Gb DDR3 devices operates with a single power supply: 1.5V ± 0.075V VDD and VDDQ. Available package: FBGA-96Ball (with 0.8mm - 0.8mm ball pitch) |
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