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04341.25NRP Datasheet(PDF) 2 Page - Littelfuse |
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04341.25NRP Datasheet(HTML) 2 Page - Littelfuse |
2 / 3 page 32 Revision: February 13, 2008 Surface Mount Fuses ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for the most current information Thin Film > 0603 Size > Very Fast Acting > 434 Series 434 Series Average Time Current Curves CURRENT IN AMPERES 0.01 0.1 0.1 1 1 10 100 10 100 0.001 Reflow Condition Pb – Free assembly Pre Heat -Temperature Min (T s(min)) 150°C -Temperature Max (T s(max)) 200°C -Time (Min to Max) (t s) 60 – 180 secs Average ramp up rate (LiquidusTemp (T L) to peak 5°C/second max T S(max) to TL - Ramp-up Rate 5°C/second max Reflow -Temperature (T L) (Liquidus) 217°C -Temperature (t L) 60 – 150 seconds PeakTemperature (T P) 250+0/-5 °C Time within 5°C of actual peak Temperature (t p) 20 – 40 seconds Ramp-down Rate 5°C/second max Time 25°C to peakTemperature (T P) 8 minutes Max. Do not exceed 260°C Soldering Parameters - Wave Soldering Temperature Rerating Curve |
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