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ADG409 Datasheet(PDF) 4 Page - Analog Devices |
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ADG409 Datasheet(HTML) 4 Page - Analog Devices |
4 / 11 page ADG408/ADG409 REV. A –4– ABSOLUTE MAXIMUM RATINGS 1 (TA = +25°C unless otherwise noted) VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +44 V VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +25 V VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –25 V Analog, Digital Inputs 2 . . . . . VSS –2 V to VDD +2 V or 20 mA, Whichever Occurs First Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 20 mA Peak Current, S or D (Pulsed at 1 ms, 10% Duty Cycle max) . . . . . . . . . . . 40 mA Operating Temperature Range Industrial (B Version) . . . . . . . . . . . . . . . . . –40 °C to +85°C Extended (T Version) . . . . . . . . . . . . . . . . –55 °C to +125°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150 °C Cerdip Package, Power Dissipation . . . . . . . . . . . . . . . 900 mW θ JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 76 °C/W Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +300 °C Plastic Package, Power Dissipation . . . . . . . . . . . . . . . 470 mW θ JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 117 °C/W Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260 °C TSSOP Package, Power Dissipation . . . . . . . . . . . . . . 450 mW θ JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 155 °C/W θ JC, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 50 °C/W SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 600 mW θ JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 77 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. 2Overvoltages at A, EN, S or D will be clamped by internal diodes. Current should be limited to the maximum ratings given. ORDERING INFORMATION Model1 Temperature Range Package Option2 ADG408BN –40 °C to +85°C N-16 ADG408BR –40 °C to +85°C R-16A ADG408BRU –40 °C to +85°C RU-16 ADG408TQ –55 °C to +125°C Q-16 ADG409BN –40 °C to +85°C N-16 ADG409BR –40 °C to +85°C R-16A ADG409TQ –55 °C to +125°C Q-16 NOTES 1To order MIL-STD-883, Class B processed parts, add /883B to T grade part numbers. 2N = Plastic DIP; Q = Cerdip; R = 0.15" Small Outline IC (SOIC); RU = Think Shrink Small Outline Package (TSSOP). CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG408/ADG409 feature proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE |
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