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ADG412 Datasheet(PDF) 4 Page - Analog Devices |
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ADG412 Datasheet(HTML) 4 Page - Analog Devices |
4 / 8 page ADG411/ADG412/ADG413 REV. A –4– ORDERING GUIDE Model l Temperature Range Package Option 2 ADG411BN –40 °C to +85°C N-16 ADG411BR –40 °C to +85°C R-16A ADG411TQ –55 °C to +125°C Q-16 ADG411BRU –40 °C to +85°C RU-16 ADG412BN –40 °C to +85°C N-16 ADG412BR –40 °C to +85°C R-16A ADG412TQ –55 °C to +125°C Q-16 ADG413BN –40 °C to +85°C N-16 ADG413BR –40 °C to +85°C R-16A NOTES 1To order MIL-STD-883, Class B processed parts, add /883B to T grade part numbers. 2N = Plastic DIP; R = 0.15" Small Outline IC (SOIC); RU= Thin Shrink Small Outline (TSSOP); Q = Cerdip. ABSOLUTE MAXIMUM RATINGS 1 (TA = +25 °C unless otherwise noted) VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+44 V VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +25 V VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –25 V VL to GND . . . . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V Analog, Digital Inputs 2 . . . . . . . . . . . VSS –2 V to VDD +2 V or 30 mA, Whichever Occurs First Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA (Pulsed at 1 ms, 10% Duty Cycle max) Operating Temperature Range Industrial (B Version) . . . . . . . . . . . . . . . . . –40 °C to +85°C Extended (T Version) . . . . . . . . . . . . . . . . –55 °C to +125°C Storage Temperature Range . . . . . . . . . . . . . –65 °C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150 °C Cerdip Package, Power Dissipation . . . . . . . . . . . . . . . 900 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 76 °C/W Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +300 °C Plastic Package, Power Dissipation . . . . . . . . . . . . . . . 470 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 117 °C/W Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260 °C SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 600 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 77 °C/W TSSOP Package, Power Dissipation . . . . . . . . . . . . . . 450 mW θ JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 115 °C/W θ JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 35 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. 2Overvoltages at IN, S or D will be clamped by internal diodes. Current should be limited to the maximum ratings given. TERMINOLOGY VDD Most positive power supply potential. VSS Most negative power supply potential in dual supplies. In single supply applications, it may be connected to GND. VL Logic power supply (+5 V). GND Ground (0 V) reference. S Source terminal. May be an input or output. D Drain terminal. May be an input or output. IN Logic control input. RON Ohmic resistance between D and S. IS (OFF) Source leakage current with the switch “OFF.” ID (OFF) Drain leakage current with the switch “OFF.” ID, IS (ON) Channel leakage current with the switch “ON.” VD (VS) Analog voltage on terminals D, S. CS (OFF) “OFF” switch source capacitance. CD (OFF) “OFF” switch drain capacitance. CD, CS (ON) “ON” switch capacitance. tON Delay between applying the digital control input and the output switching on. tOFF Delay between applying the digital control input and the output switching off. tD “OFF” time or “ON” time measured between the 90% points of both switches, when switching from one address state to another. Crosstalk A measure of unwanted signal which is coupled through from one channel to another as a result of parasitic capacitance. Off Isolation A measure of unwanted signal coupling through an “OFF” switch. Charge A measure of the glitch impulse transferred Injection from the digital input to the analog output during switching. PIN CONFIGURATION (DIP/SOIC) TOP VIEW (Not to Scale) 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 IN1 D1 S1 VSS GND S4 D4 IN4 IN2 D2 S2 VDD VL S3 D3 IN3 ADG411 ADG412 ADG413 CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG411/ADG412/ADG413 feature proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE |
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