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ADG466BN Datasheet(PDF) 3 Page - Analog Devices |
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ADG466BN Datasheet(HTML) 3 Page - Analog Devices |
3 / 10 page ADG466/ADG467 –3– REV. A ABSOLUTE MAXIMUM RATINGS 1 (TA = +25 °C unless otherwise noted) VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +44 V VS, VD, Analog Input Overvoltage with Power ON 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS – 20 V to VDD + 20 V VS, VD, Analog Input Overvoltage with Power OFF 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –35 V to +35 V Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 20 mA Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 mA (Pulsed at 1 ms, 10% Duty Cycle Max) Operating Temperature Range Industrial (B Version) . . . . . . . . . . . . . . . . . –40 °C to +85°C Storage Temperature Range . . . . . . . . . . . . . –65 °C to +125°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150 °C Plastic DIP Package θ JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 125 °C/W Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260 °C SOIC Package θ JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 160 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C µSOIC Package θ JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 160 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C SSOP Package θ JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 130 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating condi- tions for extended periods may affect device reliability. Only one absolute maxi- mum rating may be applied at any one time. 2Overvoltages at S or D will be clamped by the channel protector, see Circuit Information section of the data sheet. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG466/ADG467 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. PIN CONFIGURATIONS 8-Lead DIP, SOIC 18-Lead and SOIC SOIC 1 2 3 4 8 7 6 5 TOP VIEW (Not to Scale) ADG466 VD1 VS3 VS2 VS1 VDD VD2 VD3 VSS 14 13 12 11 17 16 15 18 10 9 8 1 2 3 4 7 6 5 TOP VIEW (Not to Scale) ADG467 VD1 VS3 VS2 VS1 VDD VD2 VD3 VD4 VS6 VS5 VS4 VD5 VD6 VD7 VD8 VSS VS8 VS7 20-Lead SSOP VD1 VS3 VS2 VS1 VDD VD2 VD3 VD4 VS6 VS5 VS4 VD5 VD6 VD7 VD8 VSS VS8 VS7 14 13 12 11 17 16 15 20 19 18 10 9 8 1 2 3 4 7 6 5 TOP VIEW (Not to Scale) ADG467 NC = NO CONNECT NC NC ORDERING GUIDE Model Temperature Range Package Description Package Options ADG466BN –40 °C to +85°C 8-Lead Plastic DIP N-8 ADG466BR –40 °C to +85°C 8-Lead Small Outline Package SO-8 ADG466BRM –40 °C to +85°C 8-Lead Micro Small Outline Package RM-8 ADG467BR –40 °C to +85°C 18-Lead Small Outline Package R-18 ADG467BRS –40 °C to +85°C 20-Lead Shrink Small Outline Package RS-20 WARNING! ESD SENSITIVE DEVICE |
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