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ADG466BN Datasheet(PDF) 3 Page - Analog Devices

Part # ADG466BN
Description  Triple and Octal Channel Protectors
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADG466BN Datasheet(HTML) 3 Page - Analog Devices

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ADG466/ADG467
–3–
REV. A
ABSOLUTE MAXIMUM RATINGS
1
(TA = +25
°C unless otherwise noted)
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +44 V
VS, VD, Analog Input Overvoltage with Power ON
2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS – 20 V to VDD + 20 V
VS, VD, Analog Input Overvoltage with Power OFF
2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –35 V to +35 V
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 20 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 mA
(Pulsed at 1 ms, 10% Duty Cycle Max)
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40
°C to +85°C
Storage Temperature Range . . . . . . . . . . . . . –65
°C to +125°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150
°C
Plastic DIP Package
θ
JA, Thermal Impedance
. . . . . . . . . . . . . . . . . . . . 125
°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260
°C
SOIC Package
θ
JA, Thermal Impedance
. . . . . . . . . . . . . . . . . . . . 160
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
µSOIC Package
θ
JA, Thermal Impedance
. . . . . . . . . . . . . . . . . . . . 160
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
SSOP Package
θ
JA, Thermal Impedance
. . . . . . . . . . . . . . . . . . . . 130
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability. Only one absolute maxi-
mum rating may be applied at any one time.
2Overvoltages at S or D will be clamped by the channel protector, see Circuit
Information section of the data sheet.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG466/ADG467 features proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
PIN CONFIGURATIONS
8-Lead
DIP, SOIC
18-Lead
and
SOIC
SOIC
1
2
3
4
8
7
6
5
TOP VIEW
(Not to Scale)
ADG466
VD1
VS3
VS2
VS1
VDD
VD2
VD3
VSS
14
13
12
11
17
16
15
18
10
9
8
1
2
3
4
7
6
5
TOP VIEW
(Not to Scale)
ADG467
VD1
VS3
VS2
VS1
VDD
VD2
VD3
VD4
VS6
VS5
VS4
VD5
VD6
VD7
VD8
VSS
VS8
VS7
20-Lead
SSOP
VD1
VS3
VS2
VS1
VDD
VD2
VD3
VD4
VS6
VS5
VS4
VD5
VD6
VD7
VD8
VSS
VS8
VS7
14
13
12
11
17
16
15
20
19
18
10
9
8
1
2
3
4
7
6
5
TOP VIEW
(Not to Scale)
ADG467
NC = NO CONNECT
NC
NC
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Options
ADG466BN
–40
°C to +85°C
8-Lead Plastic DIP
N-8
ADG466BR
–40
°C to +85°C
8-Lead Small Outline Package
SO-8
ADG466BRM
–40
°C to +85°C
8-Lead Micro Small Outline Package
RM-8
ADG467BR
–40
°C to +85°C
18-Lead Small Outline Package
R-18
ADG467BRS
–40
°C to +85°C
20-Lead Shrink Small Outline Package
RS-20
WARNING!
ESD SENSITIVE DEVICE


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