ADG708/ADG709

–5–

REV. 0

ABSOLUTE MAXIMUM RATINGS

1

°C unless otherwise noted)

Analog Inputs

30 mA, Whichever Occurs First

Digital Inputs

30 mA, Whichever Occurs First

Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA

. . . . . . . . . . . . . . . . . (Pulsed at 1 ms, 10% Duty Cycle max)

Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA

Operating Temperature Range

Industrial (B, C Versions) . . . . . . . . . . . . . –40

°C to +85°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150

°C

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although

the ADG708/ADG709 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

TSSOP Package, Power Dissipation . . . . . . . . . . . . . 432 mW

θ

150.4

°C/W

θ

27.6

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220

°C

NOTES

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability. Only one absolute

maximum rating may be applied at any one time.

limited to the maximum ratings given.

Table I. ADG708 Truth Table

A2

A1

A0

EN

Switch Condition

XXX0

NONE

00011

00112

01013

01114

10015

10116

11017

11118

X = Don’t Care

Table II. ADG709 Truth Table

A1

A0

EN

ON Switch Pair

X

X

0

NONE

00

1

1

01

1

2

10

1

3

11

1

4

X = Don’t Care.

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

ADG708BRU

–40

°C to +85°C

16-Lead Thin Shrink Small Outline Package (TSSOP)

RU-16

ADG709BRU

–40

°C to +85°C

16-Lead Thin Shrink Small Outline Package (TSSOP)

RU-16

ADG708CRU

–40

°C to +85°C

16-Lead Thin Shrink Small Outline Package (TSSOP)

RU-16

ADG709CRU

–40

°C to +85°C

16-Lead Thin Shrink Small Outline Package (TSSOP)

RU-16

PIN CONFIGURATIONS

TSSOP

A0

EN

S2

S3

S4

S1

D

1

2

16

15

5

6

7

12

11

10

3

4

14

13

8

9

TOP VIEW

(Not to Scale)

ADG708

A1

A2

S5

S6

S7

GND

S8

A0

EN

S2A

S3A

S4A

S1A

DA

1

2

16

15

5

6

7

12

11

10

3

4

14

13

8

9

TOP VIEW

(Not to Scale)

ADG709

A1

GND

S2B

S3B

S4B

S1B

DB