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MS336RAA101_SZ Datasheet(PDF) 2 Page - Coilcraft lnc. |
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MS336RAA101_SZ Datasheet(HTML) 2 Page - Coilcraft lnc. |
2 / 2 page MS336RAASeries(0805) ® © Coilcraft, Inc. 2012 1102 Silver Lake Road Cary, IL 60013 Phone 800-981-0363 Fax 847-639-1508 Email cps@coilcraft.com www.coilcraft-cps.com This product may not be used in medical or high risk applications without prior Coilcraft approval. Specifications subject to change without notice. Please check our web site for latest information. Document MS100-2 Revised 11/06/12 0805 CHIP INDUCTORS Typical Q vs Frequency Typical L vs Frequency A max B max C max D ref E F G H I J 0.090 0.068 0.060 0.020 0.050 0.020 0.040 0.070 0.040 0.030 2,29 1,73 1,52 0,51 1,27 0,51 1,02 1,78 1,02 0,76 1 10 100 1000 10 100 1000 Frequency (MHz) 220 nH 100 nH 39 nH 15 nH 3.3 nH 12 nH 6.8 nH 3.3 nH 22 nH 39 nH 68 nH 120 nH 270 nH 10 100 Frequency (MHz) 1000 10,000 100 90 80 70 60 50 40 30 20 10 0 -40 -20 020406080 100 160 140 120 Ambient temperature (°C) 120 110 100 90 80 70 60 50 40 30 20 10 0 Current Derating Core material Ceramic Terminations Tin-lead (63/37) over silver-platinum-glass frit Ambient temperature –55°C to +125°C with Imax current, +125°C to +155°C with derated current Storage temperature Component: –55°C to +155°C. Packaging: –55°C to +80°C Resistance to soldering heat Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles Temperature Coefficient of Inductance (TCL) +25 to +155 ppm/°C Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C / 85% relative humidity) Enhanced crush-resistant packaging 2000 per 7 ″ reel Plastic tape: 8 mm wide, 0.23 mm thick, 4 mm pocket spacing, 1.65 mm pocket depth J H A B overall F G E terminal F C D Terminal wraparound: approx 0.015/0,38 both ends I I Suggested Land Pattern Note: Dimensions are before solder application. For maximum over- all dimensions including solder, add 0.0025 in / 0,064 mm to B and 0.006 in / 0,15 mm to A and C. |
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