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MS524PYA302MSZ Datasheet(PDF) 1 Page - Coilcraft lnc. |
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MS524PYA302MSZ Datasheet(HTML) 1 Page - Coilcraft lnc. |
1 / 3 page ® © Coilcraft, Inc. 2012 1102 Silver Lake Road Cary, IL 60013 Phone 800-981-0363 Fax 847-639-1508 Email cps@coilcraft.com www.coilcraft-cps.com This product may not be used in medical or high risk applications without prior Coilcraft approval. Specifications subject to change without notice. Please check our web site for latest information. HighReliabilityPowerInductors MS524PYA 6060 POWER INDUCTORS Inductance2 DCR (mOhms)3 SRF (MHz)4 Irms (A)6 Part number1 ±20% (µH) typ max min typ Isat (A)5 20°C rise 40°C rise MS524PYA681MSZ 0.68 3.10 3.41 47 59 23 14.3 18.8 MS524PYA102MSZ 1.0 3.81 4.19 37 47 21 12.8 17.3 MS524PYA182MSZ 1.8 5.30 5.83 28 36 18.1 10.5 13.5 MS524PYA222MSZ 2.2 6.00 6.60 24 31 16.4 9.8 12.8 MS524PYA302MSZ 3.0 7.45 8.19 20 26 14.6 9.0 12.0 MS524PYA472MSZ 4.7 14.90 16.40 16 21 10.5 5.3 7.5 MS524PYA562MSZ 5.6 16.22 17.84 16 20 9.9 5.3 7.5 MS524PYA682MSZ 6.8 18.90 20.80 14 18 9.2 5.3 6.8 MS524PYA822MSZ 8.2 24.00 26.40 12 16 8.4 4.5 6.0 MS524PYA103MSZ 10 27.00 29.82 11 14 7.6 3.8 5.3 MS524PYA153MSZ 15 39.77 43.75 8.8 11 5.8 3.4 4.5 MS524PYA223MSZ 22 55.12 60.63 7.2 9 5.6 2.7 3.8 Terminations Tin-lead (63/37) over copper. Core material Composite Weight 1.2 – 1.3 g Ambient temperature –55°C to +105°C with Irms current, +105°C to +155°C with derated current Storage temperature Component: –55°C to +155°C. T&R packaging: –55°C to +80°C Resistance to soldering heat Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C / 85% relative humidity) Enhanced crush-resistant packaging 400/7 ″reel Plastic tape: 16 mm wide, 0.3 mm thick, 12 mm pocket spacing, 3.12 mm pocket depth 1. When ordering, please specify testing code: MS524PYA332MSZ Testing: Z = COTS H = Screening per Coilcraft CP-SA-10001 N = Screening per Coilcraft CP-SA-10004 2. Inductance tested at 100 kHz, 0.1 Vrms, 0 Adc. 3. DCR measured on a micro-ohmmeter. 4. SRF measured using an Agilent/HP 4395A or equivalent. 5. Typical dc current at which the inductance drops 30% from its value without current. 6. Typical current that causes the specified temperature rise from 25°C ambient. 7. Electrical specifications at 25°C. Refer to Doc 362 “Soldering Surface Mount Components” before soldering. ■ High temperature materials allow operation in ambient temperatures up to 155°C ■ Passes vibration testing to 80 G and shock testing to 1000 G ■ Exceptionally low DCR – 3.1 mOhm ■ Soft saturation makes them ideal for VRM/VRD applications. Document MS799-1 Revised 09/24/12 Irms Testing Irms testing was performed on a 0.060 ″ thick pcb with 4 oz. copper traces optimized to minimize additional temperature rise. Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. |
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