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MS541PYA102MSZ Datasheet(PDF) 1 Page - Coilcraft lnc. |
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MS541PYA102MSZ Datasheet(HTML) 1 Page - Coilcraft lnc. |
1 / 4 page ® © Coilcraft, Inc. 2013 1102 Silver Lake Road Cary, IL 60013 Phone 800-981-0363 Fax 847-639-1508 Email cps@coilcraft.com www.coilcraft-cps.com This product may not be used in medical or high risk applications without prior Coilcraft approval. Specifications subject to change without notice. Please check our web site for latest information. 1. When ordering, please specify testing code: MS541PYA682MSZ Testing: Z = COTS H = Screening per Coilcraft CP-SA-10001 N = Screening per Coilcraft CP-SA-10004 2. Inductance tested at 100 kHz, 0.1 Vrms using an Agilent/HP 4192A. 3. DCR measured on a micro-ohmmeter. 4. SRF measured using an Agilent/HP 4395A or equivalent. 5. Typical dc current at which the inductance drops 30% from its value without current. 6. Typical current that causes the specified temperature rise from 25°C ambient. 7. Electrical specifications at 25°C. Refer to Doc 362 “Soldering Surface Mount Components” before soldering. Inductance2 DCR (mOhms)3 SRF (MHz)4 Isat5 Irms (A)6 Part number1 ±20% (µH) typ max min typ (A) 20°C rise 40°C rise MS541PYA161MSZ 0.16 0.75 0.83 166 207 78.0 22.9 27.1 MS541PYA301MSZ 0.30 1.06 1.17 108 135 55.6 19.6 25.1 MS541PYA551MSZ 0.55 1.42 1.56 71 89 43.0 17.6 21.8 MS541PYA651MSZ 0.65 1.75 1.93 59 74 40.0 15.8 19.9 MS541PYA801MSZ 0.80 2.08 2.29 54 67 37.8 15.6 19.4 MS541PYA102MSZ 1.0 2.55 2.81 51 64 34.8 15.0 18.8 MS541PYA122MSZ 1.2 3.10 3.41 34 43 31.2 12.2 16.2 MS541PYA182MSZ 1.8 4.05 4.46 34 43 25.0 11.9 15.8 MS541PYA222MSZ 2.2 5.73 6.33 28 35 19.6 9.9 13.4 MS541PYA332MSZ 3.3 8.56 9.42 26 32 19.4 8.7 11.3 MS541PYA472MSZ 4.7 12.96 14.26 21 26 15.2 7.9 10.2 MS541PYA562MSZ 5.6 13.67 15.03 17 21 13.0 6.4 8.6 MS541PYA682MSZ 6.8 17.84 19.62 16 20 12.8 5.1 6.9 7070 POWER INDUCTORS High-Reliability PowerInductorsMS541PYA Core material Composite Terminations Tin-lead (63/37) over copper. Weight 1.9 – 2.1g Ambient temperature –55°C to +105°C with Irms current, +105°C to +155°C with derated current Storage temperature Component: –55°C to +155°C. Tape and reel packaging: –55°C to +80°C Resistance to soldering heat Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C / 85% relative humidity) Enhanced crush-resistant packaging 150 per 7 ″reel Plastic tape: 16 mm wide, 0.3 mm thick, 12 mm pocket spacing, 7.21 mm pocket depth ■ High temperature materials allow operation in ambient temperatures up to 155°C ■ Passes vibration testing to 80 G and shock testing to 1000 G ■ Tin-lead (Sn-Pb) termination for the best possible board adhesion ■ High current and very low DCR ■ Soft saturation makes them ideal for VRM/VRD applications. Irms Testing Irms testing was performed on a 0.060 ″ thick pcb with 4 oz. copper traces optimized to minimize additional temperature rise. Temperature rise is highly dependent on many factors including pcb land pattern, trace size, and proximity to other components. Therefore temperature rise should be verified in application conditions. Document MS856-1 Revised 01/08/13 |
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