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ADM3491AN Datasheet(PDF) 4 Page - Analog Devices |
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ADM3491AN Datasheet(HTML) 4 Page - Analog Devices |
4 / 12 page ADM3491 –4– REV. 0 ORDERING GUIDE Model Temperature Range Package Description Package Options ADM3491AN –40 °C to +85°C Plastic DIP N-14 ADM3491AR –40 °C to +85°C Small Outline (SOIC) R-14 ADM3491ARU –40 °C to +85°C Thin Shrink Small Outline (TSSOP) RU-16 ABSOLUTE MAXIMUM RATINGS* (TA = +25°C unless otherwise noted) VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7 V Inputs Driver Input (DI) . . . . . . . . . . . . . . . . –0.3 V to VCC + 0.3 V Control Inputs (DE, RE) . . . . . . . . . .–0.3 V to V CC + 0.3 V Receiver Inputs (A, B) . . . . . . . . . . . . . . . –7.5 V to +12.5 V Outputs Driver Outputs . . . . . . . . . . . . . . . . . . . . . –7.5 V to +12.5 V Receiver Output . . . . . . . . . . . . . . . . . –0.5 V to VCC +0.5 V Power Dissipation 14-Lead DIP . . . . . . . . . . . . . . . . 800 mW θ JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . 140 °C/W Power Dissipation 14-Lead SOIC . . . . . . . . . . . . . . . 650 mW θ JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . 115 °C/W Power Dissipation 16-Lead TSSOP . . . . . . . . . . . . . . 500 mW θ JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . 158 °C/W Operating Temperature Range Industrial (A Version) . . . . . . . . . . . . . . . . –40 °C to +85°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . +300 °C Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . .+220 °C ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >2 kV EFT Rating (IEC1000-4-4) . . . . . . . . . . . . . . . . . . . . . . >1 kV *Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum ratings for extended periods of time may affect device reliability. |
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