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AOZ8102 Datasheet(PDF) 5 Page - Alpha & Omega Semiconductors |
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AOZ8102 Datasheet(HTML) 5 Page - Alpha & Omega Semiconductors |
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5 / 9 page  AOZ8102 Rev. 1.4 August 2011 www.aosmd.com Page 5 of 9 Application Information The AOZ8102 TVS is design to protect four data lines from fast damaging transient over-voltage by clamping it to a reference. When the transient on a protected data line exceed the reference voltage the steering diode is forward bias thus, conducting the harmful ESD transient away from the sensitive circuitry under protection. PCB Layout Guidelines Printed circuit board layout is the key to achieving the highest level of surge immunity on power and data lines. The location of the protection devices on the PCB is the simplest and most important design rule to follow. The AOZ8102 devices should be located as close as possible to the noise source. The placement of the AOZ8102 devices should be used on all data and power lines that enter or exit the PCB at the I/O connector. In most systems, surge pulses occur on data and power lines that enter the PCB through the I/O connector. Placing the AOZ8102 devices as close as possible to the noise source ensures that a surge voltage will be clamped before the pulse can be coupled into adjacent PCB traces. In addition, the PCB should use the shortest possible traces. A short trace length equates to low impedance, which ensures that the surge energy will be dissipated by the AOZ8102 device. Long signal traces will act as antennas to receive energy from fields that are produced by the ESD pulse. By keeping line lengths as short as possible, the efficiency of the line to act as an antenna for ESD related fields is reduced. Minimize interconnecting line lengths by placing devices with the most interconnect as close together as possible. The protection circuits should shunt the surge voltage to either the reference or chassis ground. Shunting the surge voltage directly to the IC’s signal ground can cause ground bounce. The clamping performance of TVS diodes on a single ground PCB can be improved by minimizing the impedance with relatively short and wide ground traces. The PCB layout and IC package parasitic inductances can cause significant overshoot to the TVS’s clamping voltage. The inductance of the PCB can be reduced by using short trace lengths and multiple layers with separate ground and power planes. One effective method to minimize loop problems is to incorporate a ground plane in the PCB design. The AOZ8102 ultra-low capacitance TVS is designed to protect four high speed data transmission lines from transient over-voltages by clamping them to a fixed reference. The low inductance and construction minimizes voltage overshoot during high current surges. When the voltage on the protected line exceeds the reference voltage the internal steering diodes are forward biased, conducting the transient current away from the sensitive circuitry. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: 1. Place the TVS near the IO terminals or connectors to restrict transient coupling. 2. Fill unused portions of the PCB with ground plane. 3. Minimize the path length between the TVS and the protected line. 4. Minimize all conductive loops including power and ground loops. 5. The ESD transient return path to ground should be kept as short as possible. 6. Never run critical signals near board edges. 7. Use ground planes whenever possible. 8. Avoid running critical signal traces (clocks, resets, etc.) near PCB edges. 9. Separate chassis ground traces from components and signal traces by at least 4mm. 10. Keep the chassis ground trace length-to-width ratio <5:1 to minimize inductance. 11. Protect all external connections with TVS diodes. |
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Similar Description - AOZ8102 |
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