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GRM219R60J106ME19 Datasheet(PDF) 5 Page - Richtek Technology Corporation |
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GRM219R60J106ME19 Datasheet(HTML) 5 Page - Richtek Technology Corporation |
5 / 13 page RT8024 5 DS8024-02 March 2011 www.richtek.com Parameter Symbol Test Conditions Min Typ Max Unit FB Input Current IFB VFB = VIN −50 -- 50 nA VIN = 3.6V -- 0.3 -- PMOSFET RON PRDS(ON) IOUT = 200mA VIN = 2.5V -- 0.4 -- Ω VIN = 3.6V -- 0.25 -- NMOSFET RON NRDS(ON) IOUT = 200mA VIN = 2.5V -- 0.35 -- Ω P-Channel Current Limit IP(LM) VIN = 2.5V to 5.5 V 1 -- 1.8 A EN High-Level Input Voltage VENH VIN = 2.5V to 5.5V 1.5 -- -- V EN Low-Level Input Voltage VENL VIN = 2.5V to 5.5V -- -- 0.4 V Undervoltage Lock Out threshold -- 1.8 -- V Hysteresis -- 0.1 -- V Oscillator Frequency fOSC VIN = 3.6V, IOUT = 100mA 1.2 1.5 1.8 MHz Thermal Shutdown Temperature TSD -- 160 -- °C Min. On Time -- 50 -- ns Max. Duty Cycle 100 -- -- % LX Leakage Current VIN = 3.6V, VLX = 0V or VLX = 3.6V −1 -- 1 μA Note 1. Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability. Note 2. θJA is measured in the natural convection at TA = 25°C on a low effective single layer thermal conductivity test board of JEDEC 51-3 thermal measurement standard. Pin 2 of SOT-23-5/TSOT-23-5 packages is the case position for θJC measurement. Note 3. Devices are ESD sensitive. Handling precaution is recommended. Note 4. The device is not guaranteed to function outside its operating conditions. |
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