AMP03

–3–

REV. E

AMP03BC

Parameter

Symbol

Conditions

Limit

Units

Offset Voltage

0.5

mV max

Gain Error

0.008

% max

Input Voltage Range

IVR

±10

V min

Common-Mode Rejection

CMR

80

dB min

Power Supply Rejection Ratio

PSRR

8

µV/V max

Output Swing

V max

Short-Circuit Current Limit

Output Shorted to Ground

+45/–15

mA min

Supply Current

No Load

3.5

mA max

Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed

for standard product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing.

ABSOLUTE MAXIMUM RATINGS

1

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±18 V

Input Voltage

Output Short-Circuit Duration . . . . . . . . . . . . . . Continuous

Storage Temperature Range

P, J Package . . . . . . . . . . . . . . . . . . . . . . . –65

°C to +150°C

Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . +300

°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150

°C

Operating Temperature Range

AMP03B . . . . . . . . . . . . . . . . . . . . . . . . . –55

°C to +125°C

AMP03F, AMP03G . . . . . . . . . . . . . . . . . . –40

°C to +85°C

Package Type

JA

3

JC

Units

Header (J)

150

18

°C/W

8-Lead Plastic DIP (P)

103

43

°C/W

8-Lead SOIC (S)

155

40

°C/W

NOTES

otherwise noted.

±18 V, the absolute maximum input voltage is equal

to the supply voltage.

3

θ

θ

in socket for header and plastic DIP packages and for device soldered to printed

circuit board for SOIC package.

ORDERING GUIDE

1

Temperature

Package

Package

Model

Range

Description

Option

2

AMP03GP

–40

°C to +85°C 8-Lead Plastic DIP N-8

AMP03BJ

–40

°C to +85°C Header

H-08B

AMP03FJ

–40

°C to +85°C Header

H-08B

AMP03BJ/883C

–55

°C to +125°C Header

H-08B

AMP03GS

–40

°C to +85°C 8-Lead SOIC

SO-8

AMP03GS-REEL

–40

°C to +85°C 8-Lead SOIC

SO-8

5962-9563901MGA –55

°C to +125°C Header

H-08B

AMP03GBC

Die

NOTES

plastic DIP and header packages.

part number. Consult factory for /883 data sheet.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the AMP03 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

DICE CHARACTERISTICS

1. Reference

2. –IN

3. +IN

4. V–

5. SENSE

6. OUTPUT

7. V+

8. NC

DIE SIZE 0.076

0.076 inch, 5,776 sq. mils

(1.93

1.93 mm, 3.73 sq. mm)

BURN-IN CIRCUIT

AMP03

+18V

–18V

25k

25k

25k

SLEW RATE TEST CIRCUIT

AMP03

+15V

–15V

0.1 F

0.1 F

WARNING!

ESD SENSITIVE DEVICE