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AMP03FJ Datasheet(PDF) 3 Page - Analog Devices |
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AMP03FJ Datasheet(HTML) 3 Page - Analog Devices |
3 / 8 page AMP03 –3– REV. E WAFER TEST LIMITS (@ V S = 15 V, TA = +25 C, unless otherwise noted) AMP03BC Parameter Symbol Conditions Limit Units Offset Voltage VOS VS = ± 18 V 0.5 mV max Gain Error No Load, VIN = ± 10 V, RS = 0 Ω 0.008 % max Input Voltage Range IVR ±10 V min Common-Mode Rejection CMR VCM = ± 10 V 80 dB min Power Supply Rejection Ratio PSRR VS = ± 6 V to ± 18 V 8 µV/V max Output Swing VO RL = 2 kΩ± 12 V max Short-Circuit Current Limit ISC Output Shorted to Ground +45/–15 mA min Supply Current ISY No Load 3.5 mA max Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing. ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±18 V Input Voltage 2 . . . . . . . . . . . . . . . . . . . . . . . . . Supply Voltage Output Short-Circuit Duration . . . . . . . . . . . . . . Continuous Storage Temperature Range P, J Package . . . . . . . . . . . . . . . . . . . . . . . –65 °C to +150°C Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . +300 °C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150 °C Operating Temperature Range AMP03B . . . . . . . . . . . . . . . . . . . . . . . . . –55 °C to +125°C AMP03F, AMP03G . . . . . . . . . . . . . . . . . . –40 °C to +85°C Package Type JA 3 JC Units Header (J) 150 18 °C/W 8-Lead Plastic DIP (P) 103 43 °C/W 8-Lead SOIC (S) 155 40 °C/W NOTES 1Absolute maximum ratings apply to both DICE and packaged parts, unless otherwise noted. 2For supply voltages less than ±18 V, the absolute maximum input voltage is equal to the supply voltage. 3 θ JA is specified for worst case mounting conditions, i.e., θ JA is specified for device in socket for header and plastic DIP packages and for device soldered to printed circuit board for SOIC package. ORDERING GUIDE 1 Temperature Package Package Model Range Description Option 2 AMP03GP –40 °C to +85°C 8-Lead Plastic DIP N-8 AMP03BJ –40 °C to +85°C Header H-08B AMP03FJ –40 °C to +85°C Header H-08B AMP03BJ/883C –55 °C to +125°C Header H-08B AMP03GS –40 °C to +85°C 8-Lead SOIC SO-8 AMP03GS-REEL –40 °C to +85°C 8-Lead SOIC SO-8 5962-9563901MGA –55 °C to +125°C Header H-08B AMP03GBC Die NOTES 1Burn-in is available on commercial and industrial temperature range parts in plastic DIP and header packages. 2For devices processed in total compliance to MIL-STD-883, add /883 after part number. Consult factory for /883 data sheet. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AMP03 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. DICE CHARACTERISTICS 1. Reference 2. –IN 3. +IN 4. V– 5. SENSE 6. OUTPUT 7. V+ 8. NC DIE SIZE 0.076 0.076 inch, 5,776 sq. mils (1.93 1.93 mm, 3.73 sq. mm) BURN-IN CIRCUIT AMP03 +18V –18V 25k 25k 25k SLEW RATE TEST CIRCUIT AMP03 +15V –15V 0.1 F 0.1 F VIN = 10V VOUT = 10V WARNING! ESD SENSITIVE DEVICE |
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