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HS0-26CLV31RH-Q Datasheet(PDF) 3 Page - Intersil Corporation

Part # HS0-26CLV31RH-Q
Description  Radiation Hardened 3.3V Quad Differential Line Receiver
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Manufacturer  INTERSIL [Intersil Corporation]
Direct Link  http://www.intersil.com/cda/home
Logo INTERSIL - Intersil Corporation

HS0-26CLV31RH-Q Datasheet(HTML) 3 Page - Intersil Corporation

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HS-26CLV32RH, HS-26CLV32EH
3
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN4907.4
January 8, 2013
For additional products, see www.intersil.com/product_tree
Die Characteristics
DIE DIMENSIONS:
78 mils x 123 mils x 21 mils
(1970µm x 3120µm)
INTERFACE MATERIALS:
Glassivation:
Type: PSG (Phosphorus Silicon Glass)
Thickness: 8k
Å ±1kÅ
Substrate:
AVLSI1RA, Silicon backside, VDD backside potential
Metallization:
Bottom: Mo/TiW
Thickness: 5800
Å ±1kÅ
Top: Al/Si/Cu
Thickness: 10k
Å ±1kÅ
Worst Case Current Density:
<2.0 x 105A/cm2
Bond Pad Size:
110µm x 100µm
Metallization Mask Layout
HS-26CLV32RH, HS-26CLV32EH
AIN
VDD
BIN
AIN (2)
AOUT (3)
ENAB (4)
COUT (5)
CIN (6)
(8)
(9)
(14) BIN
(13) BOUT
(12) ENAB
(11) DOUT
(10) DIN
(1)
(16)
(15)
(7)
CIN
GND
DIN
TABLE 1. HS-26CLV32RH, HS-26CLV32EH PAD COORDINATES
PIN
NUMBER
PAD
NAME
RELATIVE TO PIN 1
X COORDINATES Y COORDINATES
1AIN
00
2
AIN
-337.1
-362
3AOUT
-337.1
-912.5
4
ENABLE
-337.1
-1319.3
5COUT
-337.1
-1774.4
6
CIN
-337.1
-2233.7
7CIN
0
-2595.7
8
GND
418.4
-2596.7
9DIN
776.4
-2595.7
10
DIN
1113.5
-2233.7
11
DOUT
1113.5
-1774.4
12
ENABLE
1113.5
-1319.3
13
BOUT
1113.5
-898.4
14
BIN
1113.5
-362
15
BIN
776.4
0
16
VDD
420.2
1
NOTE: Dimensions in microns


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