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HS0-26CLV31RH-Q Datasheet(PDF) 3 Page - Intersil Corporation |
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HS0-26CLV31RH-Q Datasheet(HTML) 3 Page - Intersil Corporation |
3 / 3 page HS-26CLV32RH, HS-26CLV32EH 3 Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN4907.4 January 8, 2013 For additional products, see www.intersil.com/product_tree Die Characteristics DIE DIMENSIONS: 78 mils x 123 mils x 21 mils (1970µm x 3120µm) INTERFACE MATERIALS: Glassivation: Type: PSG (Phosphorus Silicon Glass) Thickness: 8k Å ±1kÅ Substrate: AVLSI1RA, Silicon backside, VDD backside potential Metallization: Bottom: Mo/TiW Thickness: 5800 Å ±1kÅ Top: Al/Si/Cu Thickness: 10k Å ±1kÅ Worst Case Current Density: <2.0 x 105A/cm2 Bond Pad Size: 110µm x 100µm Metallization Mask Layout HS-26CLV32RH, HS-26CLV32EH AIN VDD BIN AIN (2) AOUT (3) ENAB (4) COUT (5) CIN (6) (8) (9) (14) BIN (13) BOUT (12) ENAB (11) DOUT (10) DIN (1) (16) (15) (7) CIN GND DIN TABLE 1. HS-26CLV32RH, HS-26CLV32EH PAD COORDINATES PIN NUMBER PAD NAME RELATIVE TO PIN 1 X COORDINATES Y COORDINATES 1AIN 00 2 AIN -337.1 -362 3AOUT -337.1 -912.5 4 ENABLE -337.1 -1319.3 5COUT -337.1 -1774.4 6 CIN -337.1 -2233.7 7CIN 0 -2595.7 8 GND 418.4 -2596.7 9DIN 776.4 -2595.7 10 DIN 1113.5 -2233.7 11 DOUT 1113.5 -1774.4 12 ENABLE 1113.5 -1319.3 13 BOUT 1113.5 -898.4 14 BIN 1113.5 -362 15 BIN 776.4 0 16 VDD 420.2 1 NOTE: Dimensions in microns |
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