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DAC8408FPC Datasheet(PDF) 3 Page - Analog Devices |
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DAC8408FPC Datasheet(HTML) 3 Page - Analog Devices |
3 / 16 page REV. A –3– DAC8408 @ VDD = +5 V; VREF = 10 V; VOUTA, B, C, D = 0 V; TA = –55 C to +125 C apply for DAC8408AT/BT, TA = –40 C to +85 C apply for DAC8408ET/FT/FP/FPC/FS; TA = 0 C to +70 C apply for DAC8408GP, unless otherwise noted. Specifications apply for DAC A, B, C, & D. Continued ELECTRICAL CHARACTERISTICS DAC8408 Parameter Symbol Conditions Min Typ Max Units POWER SUPPLY Voltage Range VDD 4.5 5.5 V Supply Current8 IDD 50 µA Supply Current 9 IDD TA = +25 °C 1.0 mA TA = Full Temperature Range 1.5 mA NOTES 1This is an end-point linearity specification. 2Guaranteed to be monotonic over the full operating temperature range. 3ppm/ °C of FSR (FSR = Full Scale Range = V REF-1 LSB.) 4Input Resistance Temperature Coefficient = +300ppm/ °C. 5Logic Inputs are MOS gates. Typical input current at +25 °C Is less than 10 nA. 6Guaranteed by design. 7From Digital Input to 90% of final analog output current. 8All Digital Inputs “0” or V DD. 9All Digital Inputs V IH or VIL. 10See Timing Diagram. 11Digital Inputs = 0 V to V DD or VDD to 0 V. 12Extrapolated: t S (1/2 LSB) = tPD + 6.2τ where τ = the measured first time con- stant of the final RC decay. 13All Digital Inputs = 0 V; V REF = +10 V. Specifications subject to change without notice. Package Type JA* JC Units 28-Pin Hermetic DIP (T) 55 10 °C/W 28-Pin Plastic DIP (P) 53 27 °C/W 28-Pin SOL (S) 68 23 °C/W 28-Contact PLCC (PC) 66 29 °C/W * θ JA is specified for worst case mounting conditions, i.e., θJA is specified for device in socket for cerdip and P-DIP packages; θ JA is specified for device soldered to printed circuit board for SOL and PLCC packages. CAUTION 1. Do not apply voltages higher than VDD +0.3 V or less than –0.3 V potential on any terminal except VREF and RFB. 2. The digital control inputs are diode-protected; however, permanent damage may occur on unconnected inputs from high energy electrostatic fields. Keep in conductive foam at all times until ready to use. 3. Use proper antistatic handling procedures. 4. Absolute Maximum Ratings apply to both packaged devices and DICE. Stresses above those listed under Absolute Maxi- mum Ratings may cause permanent damage to the device. ABSOLUTE MAXIMUM RATINGS (TA = +25 °C, unless otherwise noted.) VDD to IOUT 2A, IOUT 2B, IOUT 2C, IOUT 2D . . . . . . . . . . 0 V, +7 V VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V, +7 V IOUT 1A, IOUT 1B, IOUT 1C, IOUT 1D to DGND . . . . . . . . . –0.3 V to VDD +0.3 V RFBA, RFBB, RFBC, RFBD to IOUT . . . . . . . . . . . . . . . . . ±25 V IOUT 2A, IOUT 2B, IOUT 2C, IOUT 2D to DGND . . . . . . . . . –0.3 V to VDD + 0.3 V DB0 through DB7 to DGND . . . . . . . . –0.3 V to VDD + 0.3 V Control Logic Input Voltage to DGND . . . . . . . . . . –0.3 V + VDD + 0.3 V VREFA, VREFB, VREFC, VREFD to IOUT 2A, IOUT 2B, IOUT 2C, IOUT 2D . . . . . . . . . . . . . . . . ±25 V Operating Temperature Range Commercial Grade (GP) . . . . . . . . . . . . . . . . 0 °C to +70°C Industrial Grade (ET, FT, FP, FPC, FS) . –40 °C to +85°C Military Grade (AT, BT) . . . . . . . . . . . . . . –55 °C to +125°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150 °C Storage Temperature . . . . . . . . . . . . . . . . . . . –65 °C to +150°C Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . . +300 °C PIN CONNECTIONS DAC8408 TOP VIEW (Not to Scale) |
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