DAC8408FPC datasheet(3/16 Pages) AD

Part #	DAC8408FPC

Description	Quad 8-Bit Multiplying CMOS D/A Converter with Memory

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REV. A

–3–

DAC8408

@ VDD = +5 V; VREF =

10 V; VOUTA, B, C, D = 0 V; TA = –55 C to +125 C apply for

DAC8408AT/BT, TA = –40 C to +85 C apply for DAC8408ET/FT/FP/FPC/FS; TA = 0 C to +70 C apply for DAC8408GP, unless otherwise noted.

Specifications apply for DAC A, B, C, & D.

Continued

ELECTRICAL CHARACTERISTICS

DAC8408

Parameter

Symbol

Conditions

Min

Typ

Max

Units

POWER SUPPLY

Voltage Range

VDD

4.5

5.5

V

Supply Current8

IDD

50

µA

Supply Current

9

IDD

TA = +25

°C

1.0

mA

TA = Full Temperature Range

1.5

mA

NOTES

1This is an end-point linearity specification.

2Guaranteed to be monotonic over the full operating temperature range.

3ppm/

°C of FSR (FSR = Full Scale Range = V

REF-1 LSB.)

4Input Resistance Temperature Coefficient = +300ppm/

°C.

5Logic Inputs are MOS gates. Typical input current at +25

°C Is less than 10 nA.

6Guaranteed by design.

7From Digital Input to 90% of final analog output current.

8All Digital Inputs “0” or V

DD.

9All Digital Inputs V

IH or VIL.

10See Timing Diagram.

11Digital Inputs = 0 V to V

DD or VDD to 0 V.

12Extrapolated: t

S (1/2 LSB) = tPD + 6.2τ where τ = the measured first time con-

stant of the final RC decay.

13All Digital Inputs = 0 V; V

REF = +10 V.

Specifications subject to change without notice.

Package Type

JA*

JC

Units

28-Pin Hermetic DIP (T)

55

10

°C/W

28-Pin Plastic DIP (P)

53

27

°C/W

28-Pin SOL (S)

68

23

°C/W

28-Contact PLCC (PC)

66

29

°C/W

*

θ

JA is specified for worst case mounting conditions, i.e., θJA is specified for

device in socket for cerdip and P-DIP packages;

θ

JA is specified for device

soldered to printed circuit board for SOL and PLCC packages.

CAUTION

1. Do not apply voltages higher than VDD +0.3 V or less than

–0.3 V potential on any terminal except VREF and RFB.

2. The digital control inputs are diode-protected; however,

permanent damage may occur on unconnected inputs from

high energy electrostatic fields. Keep in conductive foam at

all times until ready to use.

3. Use proper antistatic handling procedures.

4. Absolute Maximum Ratings apply to both packaged devices

and DICE. Stresses above those listed under Absolute Maxi-

mum Ratings may cause permanent damage to the device.

ABSOLUTE MAXIMUM RATINGS

(TA = +25

°C, unless otherwise noted.)

VDD to IOUT 2A, IOUT 2B, IOUT 2C, IOUT 2D . . . . . . . . . . 0 V, +7 V

VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V, +7 V

IOUT 1A, IOUT 1B,

IOUT 1C, IOUT 1D to DGND . . . . . . . . . –0.3 V to VDD +0.3 V

RFBA, RFBB, RFBC, RFBD to IOUT . . . . . . . . . . . . . . . . .

±25 V

IOUT 2A, IOUT 2B,

IOUT 2C, IOUT 2D to DGND . . . . . . . . . –0.3 V to VDD + 0.3 V

DB0 through DB7 to DGND . . . . . . . . –0.3 V to VDD + 0.3 V

Control Logic

Input Voltage to DGND . . . . . . . . . . –0.3 V + VDD + 0.3 V

VREFA, VREFB, VREFC, VREFD to

IOUT 2A, IOUT 2B, IOUT 2C, IOUT 2D

. . . . . . . . . . . . . . . .

±25 V

Operating Temperature Range

Commercial Grade (GP) . . . . . . . . . . . . . . . . 0

°C to +70°C

Industrial Grade (ET, FT, FP, FPC, FS) . –40

°C to +85°C

Military Grade (AT, BT) . . . . . . . . . . . . . . –55

°C to +125°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150

°C

Storage Temperature . . . . . . . . . . . . . . . . . . . –65

°C to +150°C

Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . . +300

°C

PIN CONNECTIONS

DAC8408

TOP VIEW

(Not to Scale)

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