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UCC27528DR Datasheet(PDF) 2 Page - Texas Instruments |
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UCC27528DR Datasheet(HTML) 2 Page - Texas Instruments |
2 / 31 page UCC27527 UCC27528 SLUSBD0B – DECEMBER 2012 – REVISED JANUARY 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DESCRIPTION (CONT.) The UCC27528 is a dual non-inverting driver. UCC27527 features a dual input design which offers flexibility of both inverting (IN- pin) and non-inverting (IN+ pin) configuration for each channel. Either IN+ or IN- pin can be used to control the state of the driver output. The unused input pin can be used for enable and disable functions. For safety purpose, internal pull-up and Pull-down resistors on the input pins of all the devices in UCC2752x family in order to ensure that outputs are held LOW when input pins are in floating condition. UCC27528 features Enable pins (ENA and ENB) to have better control of the operation of the driver applications. The pins are internally pulled up to VDD for active high logic and can be left open for standard operation. ORDERING INFORMATION(1)(2) PART NUMBER PACKAGE OPERATING TEMPERATURE RANGE, TA UCC27527 SOIC 8-Pin (D) and WSON 8-pin (DSD) -40°C to 140°C UCC27528 SOIC 8-Pin (D) and WSON 8-pin (DSD) (1) For the most current package and ordering information, see Package Option Addendum at the end of this document. (2) All packages use Pb-Free lead finish of Pd-Ni-Au which is compatible with MSL level 1 at 255°C to 260°C peak reflow temperature to be compatible with either lead free or Sn/Pb soldering operations. DSD package is rated MSL level 2. ABSOLUTE MAXIMUM RATINGS (1) (2) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Supply voltage range VDD -0.3 to 20.0 DC -0.3 to VDD + 0.3 V OUTA, OUTB voltage Repetitive pulse < 200 ns(3) -2.0 to VDD + 0.3 Output continuous source/sink IOUT_DC 0.3 current A Output pulsed source/sink current IOUT_pulsed 5 (0.5 µs) INA, INB, INA+, INA-, INB+, INB- voltage(4) -6.5 20 ENA, ENB voltage(4) -0.3 20 V Human body model, HBM 4000 ESD(5) Charge device model, CDM 1000 Operating virtual junction temperature, TJ range -40 150 Storage temperature range, Tstg -65 150 °C Soldering, 10 sec. 300 Lead temperature Reflow 260 (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to GND unless otherwise noted. Currents are positive into, negative out of the specified terminal. See Packaging Section of the datasheet for thermal limitations and considerations of packages. (3) Values are verified by characterization on bench. (4) The maximum voltage on the Input and Enable pins is not restricted by the voltage on the VDD pin. (5) These devices are sensitive to electrostatic discharge; follow proper device handling procedures. 2 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: UCC27527 UCC27528 |
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