UCC27527

UCC27528

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SLUSBD0B – DECEMBER 2012 – REVISED JANUARY 2013

RECOMMENDED OPERATING CONDITIONS

over operating free-air temperature range (unless otherwise noted)

MIN

TYP

MAX

UNIT

Supply voltage range, VDD

4.5

12

18

V

Operating junction temperature range

-40

140

°C

Input voltage, INA, INB, INA+, INA-, INB+, INB-

-5

18

V

Enable voltage, ENA and ENB

0

18

THERMAL INFORMATION

UCC27527, UCC27528

THERMAL METRIC

D

DSD

UNITS

8 PINS

8 PINS

128

46.1

77.7

50.7

68.5

21.8

°C/W

20.7

1.1

68.0

22.0

n/a

9.0

(1)

The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(2)

The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-

standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(3)

The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(4)

The junction-to-top characterization parameter,

from the simulation data for obtaining

(5)

The junction-to-board characterization parameter,

from the simulation data for obtaining

(6)

The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific

JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

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