PIN Diode Limiter

50 MHz - 4 GHz

Rev. V1

MADL-011008

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

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North America Tel: 800.366.2266 / Fax: 978.366.2266

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Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

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Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

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Features

 Low Insertion Loss and Noise Figure

 +40 dBm Peak and +30 dBm CW Power

 +10 dBm P1dB Compression Point

 +16 dBm Flat Leakage

 Lead-Free 1.2 x 1.5 mm 6-Lead PDFN Package

 RoHS Compliant* and 260°C Reflow Compatible

Description

The MADL-011008 is a silicon PIN limiter with small

I-region length specifically designed for medium

signal applications. The limiter is available in a

lead-free 1.2 x 1.5 mm 6-lead PDFN package. The

limiter is ideally designed to provide low insertion

loss, at zero bias, as well as low flat leakage power

with fast signal response/recovery times.

The MADL-011008 PIN limiter is designed for use in

passive limiter control circuits to protect sensitive

receiver components such as low noise amplifiers

(LNA), detectors, and mixers.

Pin No.

Pin Name

Description

1

N/C

No Connection

2

GND

RF Ground

3

N/C

No Connection

4

N/C

No Connection

5

IN

RF Input

6

N/C

No Connection

7

3

Pad

GND

Pin Configuration

* Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.

Functional Schematic

Part Number

Package

MADL-011008-141200

Bulk Packaging

MADL-011008-14120T

Tape and Reel

MADL-011008-001SMB

Sample Test Board

1. Reference Application Note M513 for reel size information.

2. All sample boards include 5 loose pieces.

Handling Procedures

Please observe the following precautions to avoid

damage:

Static Sensitivity

Silicon

Integrated

Circuits

are

sensitive

to

electrostatic discharge (ESD) and can be damaged

by static electricity. Proper ESD control techniques

should be used when handling these devices.

3. The exposed pad centered on the package bottom must be

connected to RF and DC ground.