1

MLO

GENERAL DESCRIPTION

The MLO

RF and DC circuit trace in an SMT package. The RF-DC Crossover is a low cost

solution for applications where a critical RF circuit trace intersects a DC circuit pre-

cluding the need for an expensive multilayer printed circuit board. The SMT pack-

age can support frequencies up to 6 GHz. MLO

to JEDEC reliability standards and 100% electrically tested. The RF-DC crossovers

are available in NiSn.

FEATURES

• DC – 6.0 GHz

• RF – DC Crossover

• Low Loss

• DC Isolation

• Surface Mountable

• Tape and Reel

• 100% Tested

APPLICATIONS

• Mobile communications

• GPS

• Vehicle location systems

• Wireless LAN’s

LAND GRID ARRAY

ADVANTAGES

• Inherent Low Profile

• Excellent Solderability

• Low Parasitics

• Better Heat Dissipation

TOP VIEW

Frequency

Port

Ins.

Return Loss

Power

θJC

Operating

(GHz)

Impedance

Loss

(dB min)

(Watts)

(ºC /Watts)

Temperature

(ohms)

(dB max)

(ºC)

DC -2.5

50

0.05

20

30

140

-55 to +85

2.5 – 4.0

50

0.10

20

19

140

-55 to +85

4.0 – 6.0

50

0.15

15

9

140

-55 to +85

* Specification based on performance of component assembled properly on printed circuit board with 50Ω nominal impedance.

QUALITY INSPECTION

Finished parts are 100% tested for electrical

parameters and visual characteristics.

TERMINATION

NiSn compatible with automatic soldering

technologies: Pb free reflow, wave soldering, vapor

phase and manual.

OPERATING

TEMPERATURE

- 55ºC to +85ºC

X2A

Series

2020

Size

T

Packaging

T = 1000pcs T&R

T/250 = 250pcs T&R

B = Bulk

HOW TO ORDER

RFDC

Type