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ACT-D1M32B-080F14I Datasheet(PDF) 1 Page - Aeroflex Circuit Technology

Part # ACT-D1M32B-080F14I
Description  ACT-F1M32 High Speed 32 Megabit Boot Block FLASH Multichip Module
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Manufacturer  AEROFLEX [Aeroflex Circuit Technology]
Direct Link  http://www.aeroflex.com
Logo AEROFLEX - Aeroflex Circuit Technology

ACT-D1M32B-080F14I Datasheet(HTML) 1 Page - Aeroflex Circuit Technology

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eroflex Circuit Technology - Advanced Multichip Modules © SCD1661B REV A 1/16/97
General Description
Utilizing Intel’s SmartVoltage
Boot
Block
Flash
Memory
SmartDie™, the ACT–F1M32 is
a high speed, 32 megabit CMOS
flash multichip module (MCM)
designed for full temperature
range military, space, or high
reliability applications.
The ACT-F1M32 consists of
four
high-performance
Intel
X28F800BV 8 Mbit (8,388,608
bit)
memory
die.
Each
die
contains
separately
erasable
blocks, including a hardware
lockable
boot
block
(16,384
bytes), two parameter blocks
(8,192 bytes each), and 8 main
blocks (one block of 98,304
bytes
and
seven
blocks
of
131,072 bytes) This defines the
boot
block
flash
family
architecture.
The command register is
written by bringing WE to a logic
low level (VIL), while CE is low
and OE is high (VIH). Reading is
Features
Block Diagram – CQFP(F14)
Block Diagram – CQFP(F14)
s 4 Low Voltage/Power Intel 1M x 8 FLASH Die in One
MCM Package
s Overall Configuration is 1M x 32
s +5V Operation (Standard) or +3.3V (Consult Factory)
s Access Times of 80, 100 and 120 nS ( 5V VCC)
s +5V or +12V Programing
s Erase/Program Cycles
q
100,000 Commercial
q
10,000 Military and Industrial
s Sector Architecture (Each Die)
q
One 16K Protected Boot Block (Bottom Boot Block
Standard, Top Boot Block Special Order)
q
Two 8K Parameter Blocks
q
One 96K Main Block
q
Seven 128K Main Blocks
s Single Block Erase (All bits set to 1)
s Hardware Data Protection Feature
s Independent Boot Block Locking
s MIL-PRF-38534 Compliant MCMs Available
s Packaging – Hermetic Ceramic
q
68 Lead, .94" x .94" x .180" Dual-Cavity Small
Outline Gull Wing, Aeroflex code# "F14" (Drops into
the 68 Lead JEDEC .99"SQ CQFJ footprint)
s Internal Decoupling Capacitors for Low Noise
Operation
s Commercial, Industrial and Military Temperature
Ranges
CIRCUIT TECHNOLOGY
Standard Configuration
Pin Description
I/O0-31
Data I/O
A0–19
Address Inputs
WE
Write Enables
CE1-4
Chip Enables
OE
Output Enable
WP
Write Protect
RP
Reset/Powerdown
VCC
Power Supply
GND
Ground
NC
Not Connected
Pin Description
I/O0-31
Data I/O
A0–19
Address Inputs
WE1-4
Write Enable
CE1-4
Chip Enables
OE
Output Enable
RP
Reset/Powerdown
VCC
Power Supply
GND
Ground
NC
Not Connected
1Mx8
1Mx8
1Mx8
1Mx8
CE4
OE
A0 A19
I/O0-7
I/O8-15
I/O16-23
I/O24-31
8
8
8
8
CE3 WE4
WE3
WE2
WE1
CE1
CE2
RP
1Mx8
1Mx8
1Mx8
1Mx8
CE4
OE
A0 A19
I/O0-7
I/O8-15
I/O16-23
I/O24-31
8
8
8
8
CE3
WE
CE1
CE2
WP
RP
Optional Configuration
www.aeroflex.com/act1.htm
Boot Block
FLASH Multichip Module
ACT–F1M32 High Speed 32 Megabit


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