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BRR1A16NB Datasheet(PDF) 8 Page - Agere Systems |
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BRR1A16NB Datasheet(HTML) 8 Page - Agere Systems |
8 / 12 page 8 8 Agere Systems Inc. Data Sheet April 2001 BRF1A, BRF2A, BRS2B, BRR1A, and BRT1A Quad Differential Receivers Power Dissipation System designers incorporating Agere data transmission drivers in their applications should be aware of package and thermal information associated with these components. Proper thermal management is essential to the long- term reliability of any plastic encapsulated integrated circuit. Thermal management is especially important for surface-mount devices, given the increasing circuit pack density and resulting higher thermal density. A key aspect of thermal management involves the junction temperature (silicon temperature) of the integrated circuit. Several factors contribute to the resulting junction temperature of an integrated circuit: s Ambient use temperature s Device power dissipation s Component placement on the board s Thermal properties of the board s Thermal impedance of the package Thermal impedance of the package is referred to as Θja and is measured in °C rise in junction temperature per watt of power dissipation. Thermal impedance is also a function of airflow present in system application. The following equation can be used to estimate the junction temperature of any device: Tj = TA + PD Θja where: Tj is device junction temperature (°C). TA is ambient temperature (°C). PD is power dissipation (W). Θja is package thermal impedance (junction to ambient—°C/W). The power dissipation estimate is derived from two factors: s Internal device power s Power associated with output terminations Multiplying ICC times VCC provides an estimate of internal power dissipation. The power dissipated in the output is a function of the: s Termination scheme on the outputs s Termination resistors s Duty cycle of the output Package thermal impedance depends on: s Airflow s Package type (e.g., DIP, SOIC, SOIC/NB) The junction temperature can be calculated using the previous equation, after power dissipation levels and package thermal impedances are known. Figure 11 illustrates the thermal impedance estimates for the various package types as a function of airflow. This figure shows that package thermal impedance is higher for the narrow-body SOIC package. Particular attention should, therefore, be paid to the thermal management issues when using this package type. In general, system designers should attempt to maintain junction temperature below 125 °C. The following factors should be used to determine if specific data transmission drivers in particular package types meet the system reliability objectives: s System ambient temperature s Power dissipation s Package type s Airflow 12-2753(F) Figure 11. Power Dissipation DIP SOIC/NB J-LEAD SOIC/GULL WING AIRFLOW (ft./min.) 200 400 600 800 1000 1200 0 40 50 60 70 80 90 100 110 120 130 140 |
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