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STTH5L04DEE Datasheet(PDF) 5 Page - STMicroelectronics |
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STTH5L04DEE Datasheet(HTML) 5 Page - STMicroelectronics |
5 / 9 page STTH5L04DEE Package information Doc ID 023261 Rev 1 5/8 2 Package information ● Epoxy meets UL94,V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 13. PowerFLAT (3.3 x 3.3) dimensions (definitions) Table 6. PowerFLAT (3.3 x 3.3) dimensions (values) Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.95 1.0 0.037 0.039 A3 0.2 0.008 b 0.29 0.34 0.39 0.011 0.013 0.015 D 3.20 3.30 3.40 0.126 0.130 0.134 D2 2.24 2.29 2.34 0.088 0.090 0.092 E 3.20 3.30 3.40 0.126 0.130 0.134 E2 1.66 1.71 1.76 0.065 0.067 0.069 e 0.65 0.026 L 0.40 0.016 L1 0.45 0.50 0.55 0.018 0.20 0.22 0.10 mm Ref. D2 L E2 L1 b e e/2 A A3 E E/2 D D/2 a k k a Projection Exposed pad Index area (D/2 x E/2) 0.10 mm Ref. 0.20 mm Ref. nc nc |
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