Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trade-

marks of Cree, Inc.

8

xlamp xB-D white leDs

8

refloW solderiNG characteristics

Intesting,CreehasfoundXLampXB-DLEDstobecompatiblewithJEDECJ-STD-020C,usingtheparameterslisted

below.Asageneralguideline,Creerecommendsthatusersfollowtherecommendedsolderingprofileprovidedbythe

manufacturer of solder paste used.

NotethatthisgeneralguidelinemaynotapplytoallPCBdesignsandconfigurationsofreflowsolderingequipment.

Profile Feature

lead-Based solder

lead-free solder

Average Ramp-Up Rate (Ts

3 °C/second max.

3 °C/second max.

Preheat: Temperature min (Ts

100 °C

150 °C

Preheat: Temperature max (Ts

150 °C

200 °C

Preheat: Time (ts

60-120 seconds

60-180 seconds

Time maintained Above: Temperature (T

183 °C

217 °C

Time maintained Above: Time (t

60-150 seconds

60-150 seconds

Peak/ClassificationTemperature(Tp)

215 °C

260 °C

Time Within 5 °C of Actual Peak Temperature (tp)

10-30 seconds

20-40 seconds

Ramp-Down Rate

6 °C/second max.

6 °C/second max.

Time 25 °C to Peak Temperature

6 minutes max.

8 minutes max.

Note: All temperatures refer to topside of the package, measured on the package body surface.

T

P

T

L

Time

t 25˚C to Peak

Preheat

ts

t

S

t

P

25

Ramp-down

Ramp-up

Critical Zone

T

Ts

max

Ts

min