Product family data sheet

Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree

logo and XLamp are registered trademarks of Cree, Inc.

cree

Product descriPtioN

The XLamp XB-D is Cree’s newest

lighting class LeD, bringing the

next generation of performance and

price to LeD lighting applications.

The XLamp XB-D delivers similar

performance to the XP-G LeD in a

package that is 48% smaller than

the XLamp XP footprint.

Using Cree’s newest generation of

silicon carbide-based LeD chips,

XB-D is optimized to dramatically

lower system cost in any illumination

application.

features

• Cree’s smallest lighting class

LeD: 2.45 X 2.45 mm

• Up to 136 lm/W in cool white

(@ 85 °C, 350 mA)

• Available in white, 80-min CRI

white, and 70-min CRI cool

white

• 1 A maximum drive current

• Low thermal resistance:

6.5 °C/W

• Wide viewing angle: 115°

• Reflowsolderable-JEDEC

J-STD-020Ccompatible

• Unlimitedfloorlifeat

≤30°C/85%RH

• electrically neutral thermal path

• RoHS-andREACH-compliant

Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300

taBle of coNteNts

Flux Characteristics................... 2

Characteristics ......................... 3

Relative Spectral Power

Distribution.............................. 3

RelativeFluxvs.Junction

Temperature (I

electrical Characteristics............ 4

Thermal Design........................ 5

Relative Flux vs. Current ........... 5

Relative Chromaticity vs.

Temperature and Current........... 6

Typical Spatial Distribution......... 7

ReflowSolderingCharacteristics . 8

Notes...................................... 9

mechanical Dimensions............ 10

Tape and Reel ........................ 11

Packaging.............................. 12