UCC2817, UCC2818, UCC3817, UCC3818

BiCMOS POWER FACTOR PREREGULATOR

SLUS395J - FEBRUARY 2000 - REVISED MARCH 2009

2

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description (continued)

UCC2817 offers an on-chip shunt regulator with low start-up current, suitable for applications utilizing a

bootstrap supply. UCC2818 is intended for applications with a fixed supply (VCC).

Available in the 16-pin D, DW, N and PW packages.

Supply voltage VCC

18 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Supply current ICC

20 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Gate drive current, continuous

0.2 A

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Gate drive current

1.2 A

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage, CAI, MOUT, SS

8 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage, PKLMT

5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage, VSENSE, OVP/EN

10 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input current, RT, IAC, PKLMT

10 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input current, VCC (no switching)

20 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Maximum negative voltage, DRVOUT, PKLMT, MOUT

−0.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power dissipation

1 W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−55

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

300

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power dissipation

1 W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied.

Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

AVAILABLE OPTIONS

PACKAGE DEVICES

T

= T

SOIC (D) PACKAGE

SOIC (DW) PACKAGE

PDIP (N) PACKAGE

TSSOP (PW) PACKAGE

TA = TJ

Turn-on

Threshold

16 V

Turn-on

Threshold

10.2 V

Turn-on

Threshold

16 V

Turn-on

Threshold

10.2 V

Turn-on

Threshold

16 V

Turn-on

Threshold

10.2 V

Turn-on

Threshold

16 V

Turn-on

Threshold

10.2 V

−40

°C to 85°C

UCC2817D

UCC2818D

UCC2817DW

UCC2818DW

UCC2817N

UCC2818N

UCC2817PW

UCC2818PW

0

°C to 70°C

UCC3817D

UCC3818D

UCC3817DW

UCC3818DW

UCC3817N

UCC3818N

UCC3817PW

UCC3818PW

THERMAL RESISTANCE TABLE

PACKAGE

θjc(°C/W)

θja(°C/W)

SOIC−16 (D)

22

40 to 70 (1)

SOIC−16 (DW)

26

89 to 102 (1)

PDIP−16 (N)

12

25 to 50 (1)

TSSOP−16 (PW)

14 (2)

123 to 147 (2)

NOTES: (1) Specified

θja (junction to ambient) is for devices mounted to 5-inch2 FR4 PC board with one ounce copper

where noted. When resistance range is given, lower values are for 5 inch2 aluminum PC board. Test PWB

was 0.062 inch thick and typically used 0.635-mm trace widths for power packages and 1.3-mm trace

widths for non-power packages with a 100-mil x 100-mil probe land area at the end of each trace.

(2). Modeled data. If value range given for

θja, lower value is for 3x3 inch. 1 oz internal copper ground plane,

higher value is for 1x1-inch. ground plane. All model data assumes only one trace for each non-fused

lead.