ESD5482MUT5G

http://onsemi.com

5

PACKAGE DIMENSIONS

X3DFN2, 0.62x0.32, 0.355P, (0201)

CASE 152AF

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

A B

E

D

BOTTOM VIEW

b

e

2X

L

2X

2X

0.035 C

TOP VIEW

2X

0.035 C

2X

A

A1

0.05 C

0.05 C

PLANE

SIDE VIEW

DIM MIN

MAX

MILLIMETERS

A

0.25

0.33

A1

−−−

0.05

b

0.22

0.28

D

0.62 BSC

E

0.32 BSC

e

0.355 BSC

L

0.17

0.23

MOUNTING FOOTPRINT*

DIMENSIONS: MILLIMETERS

0.74

1

0.30

0.31

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

2

1

See Application Note AND8398/D for more mounting details

A

M

0.05

B

C

A

M

0.05

B

C

2X

2X

RECOMMENDED

PIN 1

INDICATOR

(OPTIONAL)

ON Semiconductor and

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ESD5482/D

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