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Reliability

VI qualification includes aging at various extreme temperatures, shock and vibration, temperature cycling, and IR reflow

simulation. The VX-721 family is capable of meeting the following qualification tests:

Environmental Compliance

Parameter

Conditions

Mechanical Shock

MIL-STD-883, Method 2002

Mechanical Vibration

MIL-STD-883, Method 2007

Solderability

MIL-STD-883, Method 2003

Gross and Fine Leak

MIL-STD-883, Method 1014

Resistance to Solvents

MIL-STD-883, Method 2016

Moisture Sensitivity Level

IPC/JEDEC J-STD-020, MSL1

Handling Precautions

ESD Ratings

Model

Minimum

Conditions

Human Body Model

1000V

MIL-STD-883, Method 3015

Charged Device Model

900V

JEDEC, JESD22-C101

Machine Model

200 V

JEDEC, JESD22-A115-A

Reflow Profile (IPC/JEDEC J-STD-020)

Parameter

Symbol

Value

PreHeat Time

t

S

60 sec Min, 180 sec Max

Ramp Up

R

UP

3 °C/sec Max

Time Above 217 °C

t

L

60 sec Min, 150 sec Max

Time To Peak Temperature

T

AMB-P

480 sec Max

Time at 260 °C

t

P

20 sec Min, 40 sec Max

Ramp Down

R

DN

6 °C/sec Max

Although ESD protection circuitry has been designed into the VX-721 proper precautions should be taken when handling and

mounting. VI employs a human body model (HBM) and a charged-device model (CDM) for ESD susceptibility testing and design

protection evaluation.

The device has been qualified to meet the JEDEC standard

for Pb-Free assembly. The temperatures and time intervals

listed are based on the Pb-Free small body requirements.

The temperatures refer to the topside of the package,

measured on the package body surface. The VX-721 device is

hermetically sealed so an aqueous wash is not an issue.

Terminal Plating: Electrolytic Ni > 1.9μm

Electrolytic Au > 0.7μm

VX-721 Single Frequency HPLL VCXO

Rev2: 14 November 2012