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©2011 Littelfuse

PGB1 Series

Specifications are subject to change without notice.

3

Revised: March 8, 2011

Surface Mount Polymeric ESD Suppressors

Environmental Specifications

Operating Temperature

-65°C to +125°C

Moisture Resistance

0402 series:

0603, ST23:

Thermal Shock

-65°C to 125°C, 30 min. cycle,

10 cycles

Vibration

to 55 to 10 Hz, 1 min. cycle, 2

hrs each in X-Y-Z)

Chemical Resistance

Solder Leach Resistance and

Terminal Adhesion

Physical Specifications

Materials

Solderability

Soldering

Parameters

Design Consideration

Because of the fast rise-time of the ESD transient, proper

consideration to achieving optimal ESD suppression. The

devices should be placed on the circuit board as close to the

source of the ESD transient as possible. Install PulseGuard

directly behind the connector so that they are the first board-

level circuit component encountered by the ESD transient.

Soldering Parameters

Reflow Condition

Pre Heat

- Temperature Min (T

150°C

- Temperature Max (T

200°C

- Time (min to max) (t

Average ramp up rate (Liquidus Temp

(T

T

Reflow

- Temperature (T

- Temperature (t

60 – 150 seconds

Peak Temperature (T

260°C

Time within 5°C of actual peak

Temperature (t

10 – 30 seconds

Ramp-down Rate

Time 25°C to peak Temperature (T