3

P/N: PM1576

MX25L4006E

REV. 1.3, FEB. 10, 2012

Figure 3. Maximum Negative Overshoot Waveform .......................................................................................... 26

CAPACITANCE TA = 25°C, f = 1.0 MHz............................................................................................................. 26

Figure 4. Maximum Positive Overshoot Waveform ............................................................................................ 26

Figure 5. INPUT TEST WAVEFORMS AND MEASUREMENT LEVEL.............................................................. 27

Figure 6. OUTPUT LOADING ........................................................................................................................... 27

Table 6. DC CHARACTERISTICS (Temperature = -40°C to 85°C, VCC = 2.7V ~ 3.6V) ................................. 28

Table 7. AC CHARACTERISTICS (Temperature = -40°C to 85°C, VCC = 2.7V ~ 3.6V) ................................. 29

Table 8. Power-Up Timing .................................................................................................................................. 30

Timing Analysis ........................................................................................................................................................31

Figure 7. Serial Input Timing .............................................................................................................................. 31

Figure 8. Output Timing...................................................................................................................................... 31

Figure 9. Hold Timing ......................................................................................................................................... 32

Figure 10. WP# Disable Setup and Hold Timing during WRSR when SRWD=1 ............................................... 32

Figure 11. Write Enable (WREN) Sequence (Command 06) ............................................................................. 33

Figure 12. Write Disable (WRDI) Sequence (Command 04).............................................................................. 33

Figure 13. Read Status Register (RDSR) Sequence (Command 05) ................................................................ 33

Figure 14. Write Status Register (WRSR) Sequence (Command 01)............................................................... 34

Figure 15. Read Data Bytes (READ) Sequence (Command 03) ...................................................................... 34

Figure 16. Read at Higher Speed (FAST_READ) Sequence (Command 0B)................................................... 35

Figure 17. Dual Output Read Mode Sequence (Command 3B)......................................................................... 35

Figure 18. Sector Erase (SE) Sequence (Command 20).................................................................................. 36

Figure 19. Block Erase (BE) Sequence (Command 52 or D8).......................................................................... 36

Figure 20. Chip Erase (CE) Sequence (Command 60 or C7)........................................................................... 36

Figure 21. Page Program (PP) Sequence (Command 02)................................................................................ 37

Figure 22. Deep Power-down (DP) Sequence (Command B9)......................................................................... 37

Figure 23. Read Electronic Signature (RES) Sequence (Command AB).......................................................... 38

Figure 24. Release from Deep Power-down (RDP) Sequence (Command AB) ............................................... 38

Figure 25. Read Identification (RDID) Sequence (Command 9F)...................................................................... 39

Figure 26. Read Electronic Manufacturer & Device ID (REMS) Sequence (Command 90).............................. 39

Figure 27. Power-up Timing ............................................................................................................................... 40

OPERATING CONDITIONS.......................................................................................................................................41

Figure 28. AC Timing at Device Power-Up......................................................................................................... 41

Figure 29. Power-Down Sequence .................................................................................................................... 42

ERASE AND PROGRAMMING PERFORMANCE .................................................................................................... 43

DATA RETENTION ...................................................................................................................................................43

LATCH-UP CHARACTERISTICS ..............................................................................................................................43

ORDERING INFORMATION......................................................................................................................................44

PART NAME DESCRIPTION.....................................................................................................................................45

PACKAGE INFORMATION........................................................................................................................................46

REVISION HISTORY .................................................................................................................................................51