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8

Document Number 81322

Rev. 1.2, 01.-Dec-09

Vishay Semiconductors

VLMO30.., VLMS30.., VLMY30..

SOLDERING PROFILE

BAR CODE PRODUCT LABEL

EXAMPLE:

A) Type of component

B) Manufacturing plant

C) SEL - selection code (bin):

e.g.: K1 = code for luminous intensity group

3

= code for color group

D) Date code year/week

E) Day code (e.g. 5: Friday)

F) Batch no.

G) Total quantity

H) Company code

Figure 11. Vishay Lead (Pb)-free Reflow Soldering Profile

(acc. to J-STD-020)

Figure 12. Double Wave Soldering of Opto Devices (all Packages)

0

50

100

150

200

250

300

0

50

100

150

200

250

300

Time (s)

240 °C

245 °C

max. 260 °C

max. 120 s

max. 100 s

217 °C

max. 30 s

max. ramp up 3 °C/s

max. ramp down 6 °C/s

19885

IR Reflow Soldering Profile for Lead (Pb)-free Soldering

Preconditioning acc. to JEDEC Level 2a

max. 2 cycles allowed

255 °C

235 °C

to 260 °C

2 K/s

ca. 200 K/s

second

wave

first wave

5 s

full line: typical

dotted line: process limits

Time (s)

lead temperature

300

250

200

150

100

50

0

0

50

100

150

200

250

948626-1

TTW Soldering (acc. to CECC00802)

100 °C

to 130 °C

forced cooling

ca. 2 K/s

ca. 5 K/s

106

37

A

H

BC

D

E

F

G

VISHAY

20119