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BSS84 Datasheet(PDF) 2 Page - Fairchild Semiconductor |
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BSS84 Datasheet(HTML) 2 Page - Fairchild Semiconductor |
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2 / 5 page  BSS84 Rev B(W) Electrical Characteristics T A = 25°C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BVDSS Drain–Source Breakdown Voltage VGS = 0 V, ID = –250 µA –50 V ∆BVDSS ∆T J Breakdown Voltage Temperature Coefficient ID = –250 µA,Referenced to 25°C –48 mV/ °C IDSS Zero Gate Voltage Drain Current VDS = –50 V, VGS = 0 V –15 µA VDS = –50 V,VGS = 0 V TJ = 125 °C –60 µA IGSS Gate–Body Leakage. VGS = ±20 V, V DS = 0 V ±10 nA On Characteristics (Note 2) VGS(th) Gate Threshold Voltage VDS = VGS, ID = –1 mA –0.8 –1.7 –2 V ∆VGS(th) ∆T J Gate Threshold Voltage Temperature Coefficient ID = –1 mA,Referenced to 25 °C 3 mV/ °C RDS(on) Static Drain–Source On–Resistance VGS = –5 V, ID = –0.10 A VGS = –5 V,ID = –0.10 A,TJ=125 °C 1.2 1.9 10 17 Ω ID(on) On–State Drain Current VGS = –5 V, VDS = – 10 V –0.6 A gFS Forward Transconductance VDS = –25V, ID = – 0.10 A 0.05 0.6 S Dynamic Characteristics Ciss Input Capacitance 73 pF Coss Output Capacitance 10 pF Crss Reverse Transfer Capacitance VDS = –25 V, V GS = 0 V, f = 1.0 MHz 5 pF RG Gate Resistance VGS = –15 mV, f = 1.0 MHz 9 Ω Switching Characteristics (Note 2) td(on) Turn–On Delay Time 2.5 5 ns tr Turn–On Rise Time 6.3 13 ns td(off) Turn–Off Delay Time 10 20 ns tf Turn–Off Fall Time VDD = –30 V, ID = – 0.27A, VGS = –10 V, RGEN = 6 Ω 4.8 9.6 ns Qg Total Gate Charge 0.9 1.3 nC Qgs Gate–Source Charge 0.2 nC Qgd Gate–Drain Charge VDS = –25 V, ID = –0.10 A, VGS = –5 V 0.3 nC Drain–Source Diode Characteristics and Maximum Ratings IS Maximum Continuous Drain–Source Diode Forward Current –0.13 A VSD Drain–Source Diode Forward Voltage VGS = 0 V, IS = –0.26 A(Note 2) –0.8 –1.2 V trr Diode Reverse Recovery Time 10 nS Qrr Diode Reverse Recovery Charge IF = –0.10A diF/dt = 100 A/µs (Note 2) 3 nC Notes: 1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. a) 350°C/W when mounted on a minimum pad.. Scale 1 : 1 on letter size paper 2. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0% |
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