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MAX5048BAUTTG16 Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX5048BAUTTG16 Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 11 page MAX5048 7.6A, 12ns, SOT23/TDFN, MOSFET Driver 2 Maxim Integrated ABSOLUTE MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS (V+ = +12V, TA = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 3) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Voltages Referenced to GND V+ ...........................................................................-0.3V to +13V IN+, IN-...................................................................-0.3V to +14V N_OUT, P_OUT ............................................-0.3V to (V+ + 0.3V) N_OUT Continuous Output Current (Note 1) ....................390mA P_OUT Continuous Output Current (Note 1).....................100mA Continuous Power Dissipation* (TA = +70°C) 6-Pin SOT23 (derate 9.1mW/°C above +70°C)............727mW 6-Pin TDFN (derate 18.2mW/°C above +70°C) .........1454mW Operating Temperature Range .........................-40°C to +125°C Storage Temperature Range .............................-65°C to +150°C Junction Temperature ......................................................+150°C Lead Temperature (soldering, 10s) .................................+300°C Soldering Temperature (reflow) .......................................+260°C Note 1: Continuous output current is limited by the power dissipation of the package. *As per JEDEC51 standard. PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLY V+ Operating Range V+ 4.0 12.6 V V+ Undervoltage Lockout UVLO V+ rising 3.25 3.6 4.00 V V+ Undervoltage Lockout Hysteresis 400 mV V+ Undervoltage Lockout to Output Delay Time V+ rising 300 ns V+ Supply Current I+ IN+ = IN- = V+ 0.95 1.5 mA n-CHANNEL OUTPUT TA = +25°C 0.23 0.26 VV+ = +10V, IN-OUT = -100mA TA = +125°C 0.38 0.43 TA = +25°C 0.24 0.28 Driver Output Resistance— Pulling Down (MAX5048AAUT/ MAX5048BAUT) RON-N VV+ = +4.5V, IN-OUT = -100mA TA = +125°C 0.40 0.47 Ω TA = +25°C 0.31 0.34 VV+ = +10V, IN-OUT = -100mA TA = +125°C 0.46 0.51 TA = +25°C 0.32 0.36 Driver Output Resistance— Pulling Down (MAX5048AATT/ MAX5048BATT) RON-N VV+ = +4.5V, IN-OUT = -100mA TA = +125°C 0.48 0.55 Ω Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. PACKAGE THERMAL CHARACTERISTICS (Note 2) SOT23 Junction-to-Case Thermal Resistance ( θJC)......................75°C/W TDFN Junction-to-Case Thermal Resistance ( θJC).......................8.5°C/W |
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