MAX5048

7.6A, 12ns, SOT23/TDFN, MOSFET Driver

2

Maxim Integrated

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Voltages Referenced to GND

V+ ...........................................................................-0.3V to +13V

IN+, IN-...................................................................-0.3V to +14V

N_OUT, P_OUT ............................................-0.3V to (V+ + 0.3V)

N_OUT Continuous Output Current (Note 1) ....................390mA

P_OUT Continuous Output Current (Note 1).....................100mA

6-Pin SOT23 (derate 9.1mW/°C above +70°C)............727mW

6-Pin TDFN (derate 18.2mW/°C above +70°C) .........1454mW

Operating Temperature Range .........................-40°C to +125°C

Storage Temperature Range .............................-65°C to +150°C

Junction Temperature ......................................................+150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow) .......................................+260°C

Note 1: Continuous output current is limited by the power dissipation of the package.

*As per JEDEC51 standard.

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

POWER SUPPLY

V+ Operating Range

V+

4.0

12.6

V

V+ Undervoltage Lockout

UVLO

V+ rising

3.25

3.6

4.00

V

V+ Undervoltage Lockout

Hysteresis

400

mV

V+ Undervoltage Lockout to

Output Delay Time

V+ rising

300

ns

V+ Supply Current

I+

IN+ = IN- = V+

0.95

1.5

mA

n-CHANNEL OUTPUT

0.23

0.26

0.38

0.43

0.24

0.28

Driver Output Resistance—

Pulling Down (MAX5048AAUT/

MAX5048BAUT)

0.40

0.47

Ω

0.31

0.34

0.46

0.51

0.32

0.36

Driver Output Resistance—

Pulling Down (MAX5048AATT/

MAX5048BATT)

0.48

0.55

Ω

Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

PACKAGE THERMAL CHARACTERISTICS (Note 2)

SOT23

Junction-to-Case Thermal Resistance (

TDFN

Junction-to-Case Thermal Resistance (