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A1007 Datasheet(PDF) 11 Page - List of Unclassifed Manufacturers |
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A1007 Datasheet(HTML) 11 Page - List of Unclassifed Manufacturers |
11 / 24 page 10 Problems during Desoldering A. The solder in the junction is not sufficiently melted. B. Suction power is dropping. Post-operation Maintenance To ensure a long service life, always perform the following maintenance procedures immediately after using the HAKKO 475 unit. A. The solder in the junction is not sufficiently melted. Temperature is not high enough The following parts require a greater heat capacity to desol- der. • Multilayer P.W.B.s, power supplies, ground planes in through-hole P.W.B.s, high-capacity transistors, triacs with heat radiation fins, tuner P.W.B. ground wires, and large-scale transformer terminals. Use a preheating oven or heating gun to heat the P.W.B. to a temperature that wonʼt damage the board or its components [between 70°C (160°F) and 80°C (180°F)], then desolder. Do not increase the temperature of the gun by recalibration as this may damage the P.W.B. and its components. Nozzle is worn out. • When the nozzle begins to wear out, the heating effi- ciency begins to decline. Check the nozzle. If the solder plating is damaged, or the nozzle is eroded, replace the nozzle. (refer to p.12) B. Suction power is dropping. • Replace the filters, and clean the nozzle and the inside of the heating element, (refer to p.12 to p.16, Maintenance of Desoldering Gun and Station) Air is leaking from the vacuum system. Air leakage cannot be determined from the indicator. Check the air-tightness of the following parts and replace any that are worn. Remove all solder from the inside of the nozzle and heat- ing element. Clean the tip of the nozzle with the cleaning sponge, then coat the tip with a fresh layer of solder to protect the solder plating. a. Contact point of the nozzle and heating element b. Front holder and nearby parts c. O-ring in the back holder d. Hose e. Vacuum outlet cap f. Packing and nearby parts The air pressure is low. Check the air pressure and connections. (refer to p.6) |
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