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BZT52C6V2S Datasheet(PDF) 1 Page - Microdiode Electronics (Jiangsu) Co.,Ltd. |
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BZT52C6V2S Datasheet(HTML) 1 Page - Microdiode Electronics (Jiangsu) Co.,Ltd. |
1 / 4 page BZT52C2V4S-BZT52C39S ZENER DIODE Case: Molded plastic body Terminals: Plated leads solderable per MIL-STD-750, Method 2026 Polarity: Polarity symbols marked on case FEATURES MECHANICAL DATA Planar die construction Ultra-Small surface mount package Ideally suited for automated assembly processes 0.9 200 625 -65 to +150 Maximum ratings (Tamb=25C unless otherwise specified) SYMBOLS UNITS VF Pd TJ,TSTG V mW C/W C Limits PARAMETER RΘJA Forward voltage (Note 2) @IF=10mA Power dissipation (Note1) Thermal resistance, Junction to ambient air (Note1) Operating and storage temperature range NOTES: 1.Valid provided that device terminals are kept at ambient temperature. 2.Short duration test pulse used in minimize self-heating effect. 3.f=1KHz. SOD-323 1.35(0.053) 1.15(0.045) 1.00(.040) 0.80(.031) .08(.003) MIN .177(.007) .089(.003) 0.4(0.016) .25(0.010) 1.26(.050) 1.24(.048) .305(0.012) .295(0.010) 0.1(0.004) MIN .72(0.028) .69(0.027) 1.80(0.071) 1.60(0.063) 2.75(0.108) 2.30(0.091) 1.80(0.071) 1.60(0.063) 2.75(0.108) 2.30(0.091) Dimensions in millimeters and (inches) MDD ELECTRONIC |
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