W9751G6KB25K datasheet(4/87 Pages) WINBOND

Part #	W9751G6KB25K

Description	Double Data Rate architecture: two data transfers per clock cycle

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Manufacturer	WINBOND [Winbond]

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W9751G6KB

Publication Release Date: Sep. 03, 2012

- 4 -

Revision A04

1.

GENERAL DESCRIPTION

The W9751G6KB is a 512M bits DDR2 SDRAM, organized as 8,388,608 words

 4 banks  16 bits.

This device achieves high speed transfer rates up to 1066Mb/sec/pin (DDR2-1066) for various

applications. W9751G6KB is sorted into the following speed grades: -18, -25, 25I, 25A, 25K and -3.

The -18 is compliant to the DDR2-1066 (7-7-7) specification. The -25, 25I, 25A and 25K grade parts

are compliant to the DDR2-800 (5-5-5) or DDR2-800 (6-6-6) specification (the 25I industrial grade

which is guaranteed to support -40°C

≤ TCASE ≤ 95°C). The -3 is compliant to the DDR2-667 (5-5-5)

specification.

The automotive grade parts temperature, if offered, has two simultaneous requirements: ambient

temperature (TA) surrounding the device cannot be less than -40°C or greater than +95°C (for 25A),

+105°C (for 25K), and the case temperature (TCASE) cannot be less than -40°C or greater than +95°C

(for 25A), +105°C (for 25K). JEDEC specifications require the refresh rate to double when TCASE

exceeds +85°C; this also requires use of the high-temperature self refresh option. Additionally, ODT

resistance and the input/output impedance must be derated when TCASE is < 0°C or > +85°C.

All of the control and address inputs are synchronized with a pair of externally supplied differential

clocks. Inputs are latched at the cross point of differential clocks (CLK rising and CLK falling). All

I/Os are synchronized with a single ended DQS or differential DQS- DQS pair in a source

synchronous fashion.

2.

FEATURES



Power Supply: VDD, VDDQ = 1.8 V

 0.1V



Double Data Rate architecture: two data transfers per clock cycle



CAS Latency: 3, 4, 5, 6 and 7



Burst Length: 4 and 8



Bi-directional, differential data strobes (DQS and DQS ) are transmitted / received with data



Edge-aligned with Read data and center-aligned with Write data



DLL aligns DQ and DQS transitions with clock



Differential clock inputs (CLK and CLK )



Data masks (DM) for write data



Commands entered on each positive CLK edge, data and data mask are referenced to both edges

of DQS



Posted CAS programmable additive latency supported to make command and data bus efficiency



Read Latency = Additive Latency plus CAS Latency (RL = AL + CL)



Off-Chip-Driver impedance adjustment (OCD) and On-Die-Termination (ODT) for better signal

quality



Auto-precharge operation for read and write bursts



Auto Refresh and Self Refresh modes



Precharged Power Down and Active Power Down



Write Data Mask



Write Latency = Read Latency - 1 (WL = RL - 1)



Interface: SSTL_18



Packaged in WBGA 84 Ball (8X12.5 mm

2), using Lead free materials with RoHS compliant

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