160 CLA

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Vishay BCcomponents

Revision: 23-Apr-13

3

Document Number: 28405

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Table 2

Note

• Detailed tape dimensions see section “PACKAGING”

MOUNTING

The capacitors are designed for automatic placement on to

printed-circuit boards.

Optimum dimensions of soldering pads depend amongst

others on soldering method, mounting accuracy, print

layout and/or adjacent components.

For recommended soldering pad dimensions, refer to Fig. 3

and Table 3.

SOLDERING

Soldering conditions are defined by the curve, temperature

versus time, where the temperature is that measured on the

component during processing.

For maximum conditions refer to Fig. 4.

Any temperature versus time curve which does not exceed

the specified maximum curves may be applied.

As a general principle, temperature and duration shall be the

minimum necessary required to ensure good soldering

connections. However, the specified maximum curves

should never be exceeded.

Fig. 3 - Recommended soldering pad dimensions

Table 3

TAPE AND REEL DIMENSIONS in millimeters, PACKAGING QUANTITIES

NOMINAL

CASE SIZE

L x W x H

CASE

CODE

PITCH

TAPE WIDTH

W

TAPE

THICKNESS

REEL DIAMETER

PACKAGING

QUANTITY

PER REEL

12.5 x 12.5 x 13

1213

20

24

16.2

380

250

12.5 x 12.5 x 16

1216

24

32

18.5

380

200

16 x 16 x 16

1616

28

44

18.9

380

150

16 x 16 x 21

1621

28

44

23.4

380

100

18 x 18 x 16

1816

32

44

18.9

380

125

18 x 18 x 21

1821

32

44

23.4

380

100

RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters

CASE CODE

a

b

c

d

e

f

1213

6.3

2.5

4.0

4.2

5.0

5.6

1216

6.3

2.5

4.0

4.2

5.0

5.6

1616

7.8

9.6

4.7

-

-

-

1621

7.8

9.6

4.7

-

-

-

1816

8.8

9.6

4.7

-

-

-

1821

8.8

9.6

4.7

-

-

-

aa

c

b

e

d

f

d

Case size Ø D = 12.5 mm

Case size Ø D

≥ 16 mm

a

a

b

c