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MAX16936SATEB Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX16936SATEB Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 17 page MAX16936 36V, 220kHz to 2.2MHz Step-Down Converter with 28µA Quiescent Current 2 Maxim Integrated SUP, SUPSW, LX, EN to PGND ............................-0.3V to +42V SUP to SUPSW.....................................................-0.3V to +0.3V BIAS to AGND.........................................................-0.3V to +6V SYNCOUT, FOSC, COMP, FSYNC, PGOOD, FB to AGND ........................ -0.3V to (VBIAS + 0.3V) OUT to PGND........................................................-0.3V to +12V BST to LX.................................................................-0.3V to +6V AGND to PGND...................................................-0.3V to + 0.3V LX Continuous RMS Current ...................................................3A Output Short-Circuit Duration....................................Continuous Continuous Power Dissipation (TA = +70NC)* TSSOP (derate 26.1mw/NC above +70NC) .............2088.8mW TQFN (derate 28.6mw/NC above +70NC) ...............2285.7mW Operating Temperature Range........................ -40NC to +125NC Junction Temperature .....................................................+150NC Storage Temperature Range............................ -65NC to +150NC Lead Temperature (soldering, 10s) ................................+300NC Soldering Temperature (reflow) ......................................+260NC ABSOLUTE MAXIMUM RATINGS Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera- tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. *As per JEDEC51 standard (multilayer board). TSSOP Junction-to-Ambient Thermal Resistance (BJA) .......38.3NC/W Junction-to-Case Thermal Resistance (BJC) .................3NC/W TQFN Junction-to-Ambient Thermal Resistance (BJA) ..........35NC/W Junction-to-Case Thermal Resistance (BJC) ..............2.7NC/W PACKAGE THERMAL CHARACTERISTICS (Note 1) ELECTRICAL CHARACTERISTICS (VSUP = VSUPSW = 14V, VEN = 14V, L1 = 2.2FH, CIN = 4.7FF, COUT = 22FF, CBIAS = 1FF, CBST = 0.1FF, RFOSC = 12kI, TA = TJ = -40NC to +125NC, unless otherwise noted. Typical values are at TA = +25NC.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage VSUP, VSUPSW 3.5 36 V Load Dump Event Supply Voltage VSUP_LD tLD < 1s 42 V Supply Current ISUP_STANDBY Standby mode, no load, VOUT = 5V, VFSYNC = 0V 28 40 F A Shutdown Supply Current ISHDN VEN = 0V 5 8 F A BIAS Regulator Voltage VBIAS VSUP = VSUPSW = 6V to 42V, IBIAS = 0 to 10mA 4.7 5 5.4 V BIAS Undervoltage Lockout VUVBIAS VBIAS rising 2.95 3.15 3.40 V BIAS Undervoltage Lockout Hysteresis 450 650 mV Thermal Shutdown Threshold +175 N C Thermal Shutdown Threshold Hysteresis 15 N C OUTPUT VOLTAGE (OUT) FPWM Mode Output Voltage VOUT VFB = VBIAS, 6V < VSUPSW < 36V, fixed-frequency mode (Note 2) 4.9 5 5.1 V |
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