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MAX16936SATEB Datasheet(PDF) 2 Page - Maxim Integrated Products

Part # MAX16936SATEB
Description  36V, 220kHz to 2.2MHz Step-Down Converter with 28μA Quiescent Current
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Manufacturer  MAXIM [Maxim Integrated Products]
Direct Link  https://www.maximintegrated.com/en.html
Logo MAXIM - Maxim Integrated Products

MAX16936SATEB Datasheet(HTML) 2 Page - Maxim Integrated Products

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MAX16936
36V, 220kHz to 2.2MHz Step-Down Converter
with 28µA Quiescent Current
2
Maxim Integrated
SUP, SUPSW, LX, EN to PGND ............................-0.3V to +42V
SUP to SUPSW.....................................................-0.3V to +0.3V
BIAS to AGND.........................................................-0.3V to +6V
SYNCOUT, FOSC, COMP, FSYNC,
PGOOD, FB to AGND ........................ -0.3V to (VBIAS + 0.3V)
OUT to PGND........................................................-0.3V to +12V
BST to LX.................................................................-0.3V to +6V
AGND to PGND...................................................-0.3V to + 0.3V
LX Continuous RMS Current ...................................................3A
Output Short-Circuit Duration....................................Continuous
Continuous Power Dissipation (TA = +70NC)*
TSSOP (derate 26.1mw/NC above +70NC) .............2088.8mW
TQFN (derate 28.6mw/NC above +70NC) ...............2285.7mW
Operating Temperature Range........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
*As per JEDEC51 standard (multilayer board).
TSSOP
Junction-to-Ambient Thermal Resistance (BJA) .......38.3NC/W
Junction-to-Case Thermal Resistance (BJC) .................3NC/W
TQFN
Junction-to-Ambient Thermal Resistance (BJA) ..........35NC/W
Junction-to-Case Thermal Resistance (BJC) ..............2.7NC/W
PACKAGE THERMAL CHARACTERISTICS (Note 1)
ELECTRICAL CHARACTERISTICS
(VSUP = VSUPSW = 14V, VEN = 14V, L1 = 2.2FH, CIN = 4.7FF, COUT = 22FF, CBIAS = 1FF, CBST = 0.1FF, RFOSC = 12kI,
TA = TJ = -40NC to +125NC, unless otherwise noted. Typical values are at TA = +25NC.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
VSUP, VSUPSW
3.5
36
V
Load Dump Event Supply
Voltage
VSUP_LD
tLD < 1s
42
V
Supply Current
ISUP_STANDBY
Standby mode, no load, VOUT = 5V,
VFSYNC = 0V
28
40
F
A
Shutdown Supply Current
ISHDN
VEN = 0V
5
8
F
A
BIAS Regulator Voltage
VBIAS
VSUP = VSUPSW = 6V to 42V,
IBIAS = 0 to 10mA
4.7
5
5.4
V
BIAS Undervoltage Lockout
VUVBIAS
VBIAS rising
2.95
3.15
3.40
V
BIAS Undervoltage Lockout
Hysteresis
450
650
mV
Thermal Shutdown Threshold
+175
N
C
Thermal Shutdown Threshold
Hysteresis
15
N
C
OUTPUT VOLTAGE (OUT)
FPWM Mode Output Voltage
VOUT
VFB = VBIAS, 6V < VSUPSW < 36V,
fixed-frequency mode (Note 2)
4.9
5
5.1
V


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